Comparison of grinding characteristics of different crystal surfaces for sapphire

Ming-jian SHAO; Jian-min GUO; Shen-gui HUANG; Xi-peng XU

doi:10.3788/OPE.20172505.1250

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Comparison of grinding characteristics of different crystal surfaces for sapphire

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-07-07

- Comparison of grinding characteristics of different crystal surfaces for sapphire
- Optics and Precision Engineering Vol. 25, Issue 5, Pages: 1250-1258(2017)
- 作者机构：
  
  华侨大学制造工程研究院, 福建厦门 361021
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20172505.1250
  CLC： TH145.9;TN305.2
- Received：05 September 2016，
  
  Accepted：07 December 2016，
  
  Published：25 May 2017
- 稿件说明：
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Ming-jian SHAO, Jian-min GUO, Shen-gui HUANG, et al. Comparison of grinding characteristics of different crystal surfaces for sapphire[J]. Optics and precision engineering, 2017, 25(5): 1250-1258.
DOI：

Ming-jian SHAO, Jian-min GUO, Shen-gui HUANG, et al. Comparison of grinding characteristics of different crystal surfaces for sapphire[J]. Optics and precision engineering, 2017, 25(5): 1250-1258. DOI： 10.3788/OPE.20172505.1250.

摘要

比较了蓝宝石不同晶面磨削特性的差异。对蓝宝石晶体的A面、C面、M面及R面开展精密磨削试验，并从磨削力、磨削力比、比磨削能及表面形貌等角度比较了蓝宝石4个晶面磨削特性的差异。采用金刚石砂轮在精密平面磨床上对蓝宝石4个晶面进行磨削，采用测力仪测量磨削过程中的磨削力，并根据所测得的磨削力计算磨削力比和比磨削能。最后，采用扫描电子显微镜观测工件磨削表面形貌。试验结果显示：蓝宝石的4个晶面中C面的磨削力最大，其次是M面和A面，R面的磨削力最小；比磨削能亦为C面最大，其次是M面和A面，R面的比磨削能最小；磨削力比则是M面最大，其次是A面和C面，R面的磨削力比最小。在相同磨削条件下，蓝宝石不同晶面磨削材料的去除方式有所不同，A面、M面和R面主要以脆性断裂、破碎和解离方式去除为主，且破碎坑较大，表面相对较为粗糙；而C面则存在部分脆性断裂和部分粉末化去除，破碎坑较小，表面相对平整。因此，蓝宝石不同晶面的磨削特性差异明显，其磨削力、磨削力比、比磨削能及材料去除方式均存在明显的不同。

Abstract

The different grinding characteristics of different crystal faces of a sapphire were compared. A precision grinding test of A-plane

C-plane

M-plane and R-plane for the sapphire was carried out from the grinding force

grinding force ratio

specific grinding energy and surface topography to research their grinding characteristics. Four crystal faces of the sapphire were grinded by a diamond grinding wheel on a precision surface grinder. The grinding forces were measured by a dynamometer

and the grinding force ratio and the specific grinding energy were calculated according to the measured grinding forces. The surface morphology of a workpiece was observed by a scanning electron microscopy. The results indicate that the different faces of the sapphire have different grinding forces

and the C-plane shows the maximum value

followed by the M-plane

A-plane

and the R-plane. The size orders of specific grinding energy are the same as the grinding force. However

the maximum value of grinding force ratio is for the M-plane

followed that by the A-plane and C-plane

and the R-plane is the minimum one. Under the same grinding conditions

the different crystal faces have different grinding material removal modes. The A-plane

M-plane and R-plane are mainly based on brittle fracture

fragmentation and dissociation removal

the crushing pit is larger

and the surface is rough. The C-plane is mainly based on part of the brittle fracture and part of powder removal

the broken crater is smaller

and the surface is relatively smooth. As a results

since the A-plane

C-plane

M-plane and R-plane of the sapphire have different grinding characteristics

they show different grinding mechanisms

grinding forces

grinding force ratios

specific grinding energies and material removal modes.

关键词

Keywords

references

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