Technological parameter optimization and quality effects on solid-liquid phase abrasive flow polishing

Jun-ye LI; Jing-lei HU; Kun DONG; Zhen WANG; Li-bin ZHOU; Xin-ming ZHANG

doi:10.3788/OPE.20172506.1534

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Technological parameter optimization and quality effects on solid-liquid phase abrasive flow polishing

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-07-07

- Technological parameter optimization and quality effects on solid-liquid phase abrasive flow polishing
- Optics and Precision Engineering Vol. 25, Issue 6, Pages: 1534-1546(2017)
- 作者机构：
  
  长春理工大学机电工程学院, 吉林长春 130022
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20172506.1534
  CLC： TG580.692.2
- Received：28 September 2016，
  
  Accepted：14 November 2016，
  
  Published：25 June 2017
- 稿件说明：
移动端阅览
Jun-ye LI, Jing-lei HU, Kun DONG, et al. Technological parameter optimization and quality effects on solid-liquid phase abrasive flow polishing[J]. Optics and precision engineering, 2017, 25(6): 1534-1546.
DOI：

Jun-ye LI, Jing-lei HU, Kun DONG, et al. Technological parameter optimization and quality effects on solid-liquid phase abrasive flow polishing[J]. Optics and precision engineering, 2017, 25(6): 1534-1546. DOI： 10.3788/OPE.20172506.1534.

摘要

为研究磨粒流对异形腔孔内壁表面以及微小孔的研抛去毛刺等的作用效果，探讨了研抛过程中磨粒流各工艺参数与加工质量间的作用关系。以共轨管这种非直线管为研究对象，对磨粒流抛光共轨管过程进行数值模拟研究，探索各工艺参数对磨粒流研抛的影响。数值模拟结果表明：控制碳化硅体积分数可以改变磨粒流研抛过程中的粘温特性，从而可以控制磨粒流的研抛质量。然后采用正交方法设计实验方案，实验过程中，采集抛光过程中温度和粘度的变化数据，分析磨粒流研抛中粘温特性对磨粒流研抛质量的影响。试验与数值模拟结果表明，在磨粒流研抛共轨管过程中SiC的体积分数比出口压力的极差秩大，磨粒流研抛确实可有效改善工件表面质量。而且本文还进一步得出在本试验条件下，磨粒流研抛共轨管的最佳工艺参数：出口压力为5 MPa，SiC体积分数为0.25%，SiC目数为80，同时获得了表面粗糙度与体积分数的回归方程，可用于指导磨粒流实际研抛生产工作。

Abstract

To study the effect of abrasive flow polishing on internal surface of heteromorphic coelomopore and polishing deburring of micro-holes

the function relationship between each technological parameter of abrasive flow and processing quality in the process of polishing was discussed. Common rail pipe that is a type of non-straight pipe was taken as research object

and numerical simulation study was implemented for abrasive flow polishing process

the influence of each technological parameter on abrasive flow polishing was explored. Numerical simulation results show that: the viscosity-temperature characteristics in the process of abrasive flow polishing can be changed by controlling volume fraction of SiC

thus the control of quality for abrasive flow polishing can be realized. Then orthogonal method was adopted to design experiment scheme. Changed data of temperature and viscosity in polishing process was collected and influence of viscosity-temperature characteristics on quality of abrasive flow polishing was analyzed. The experimental and numerical simulation results show that the range rank of SiC volume fraction is higher than that of exit pressure in the process of abrasive flow polishing. What's more significant is the quality of work-piece surface can be effectively improved by abrasive flow polishing. Under the condition of the experiment

the exit pressure of the optimum technology parameter for common rail tube of abrasive flow polishing is 5 MPa; the volume fraction of SiC is 0.25%; the mesh number of SiC is 80; the regression equation of surface roughness and volume fraction can be obtained at the same time

which can be applied to guide production of practical polishing for abrasive flow.

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Keywords

references

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