A joint structure and self-balancing jig based on ultrasonic bonding

Chong LIU; Fan-jian MENG; Chao LIANG; Jing-min LI

doi:10.3788/OPE.20182603.0672

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A joint structure and self-balancing jig based on ultrasonic bonding

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-07-05

- A joint structure and self-balancing jig based on ultrasonic bonding
- Optics and Precision Engineering Vol. 26, Issue 3, Pages: 672-679(2018)
- 作者机构：
  
  大连理工大学辽宁省微纳米及系统重点实验室, 辽宁大连 116024
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20182603.0672
  CLC： TB559;TN405
- Received：16 May 2017，
  
  Accepted：18 July 2017，
  
  Published：25 March 2018
- 稿件说明：
移动端阅览
Chong LIU, Fan-jian MENG, Chao LIANG, et al. A joint structure and self-balancing jig based on ultrasonic bonding[J]. Optics and precision engineering, 2018, 26(3): 672-679.
DOI：

Chong LIU, Fan-jian MENG, Chao LIANG, et al. A joint structure and self-balancing jig based on ultrasonic bonding[J]. Optics and precision engineering, 2018, 26(3): 672-679. DOI： 10.3788/OPE.20182603.0672.

摘要

聚合物微流控芯片对键合精度、键合强度及键合效率要求高。为了避免超声波键合中微通道被堵塞

解决键合过程中由调平精度和高频振动引起的键合强度低、键合压力分布不均的问题

设计了一种基于超声波键合的熔接结构和压力自平衡夹具。首先

利用感压胶片对压力自平衡夹具和不带自平衡功能的夹具的压力分布进行测量

并定义了压力分布系数进行量化。其次

利用两种夹具分别对设计芯片进行超声键合

并利用工具显微镜对焊线和微通道截面进行观测。最后

对两组芯片进行键合强度测试和密封性测试。实验结果表明:所设计的熔接接头结构对微通道的控制精度可达2.0

m。压力自平衡夹具结构简单可靠

可提高压力均匀性35.20%~43.18%

并使得焊线均匀一致

同时可提高键合强度15.3%~45.1%

并保证密封性。该熔接结构和压力自平衡夹具可满足聚合物微流控芯片的控制精度、键合强度、压力均匀性及其密封性的要求。

Abstract

Polymer microfluidic chips have high requirements for bonding precision

bonding strength and bonding efficiency.In order to avoid the clogging of microchannel by fusion and solve the problems of low bonding strength

uneven pressure distribution caused by leveling precision and high-frequency vibration in the process of ultrasonic bonding

the joint structure and self-balancing jig were designed and fabricated.First

based on the self-balancing jig and conventional jig with no leveling function

the pressure distribution coefficient was defined and measured by prescale film.Moreover

the chips we designed were bonded with two types of jigs respectively.The bonding line and cross-section of microchannels were measured by measuring microscope.Last

these chips were tested by electric tensile tester and sealing test.Experimental results indicate that the precision of controlling microchannel can reach about 2.0

m.The self-balancing jig can improve pressure distribution about 35.20%-43.18% with simple structure and easy operation

and make the bonding line uniform.The bonding strength increases about 15.3%-45.1% with excellent sealing performance.It concludes that the joint structure and self-balancing jig can satisfy the requirements of controlling precision

bonding strength

pressure distribution and sealing performance.

关键词

Keywords

references

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Joint structure and processing parameters of ultrasonic precision bonding for point-of-care testing chips

Related Author

LIU Chong

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Related Institution

Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology

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