Wafer-level composite mold for large-area nanoimprint lithography

Hong-bo LAN; Liang-le GUO; Quan XU; Lei QIAN

doi:10.3788/OPE.20182604.0894

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Wafer-level composite mold for large-area nanoimprint lithography

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-07-05

- Wafer-level composite mold for large-area nanoimprint lithography
- Optics and Precision Engineering Vol. 26, Issue 4, Pages: 894-905(2018)
- 作者机构：
  
  青岛理工大学纳米制造与纳光电子实验室, 山东青岛 266520
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20182604.0894
  CLC： TN305.7
- Received：18 July 2017，
  
  Accepted：09 September 2017，
  
  Published：25 April 2018
- 稿件说明：
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Hong-bo LAN, Liang-le GUO, Quan XU, et al. Wafer-level composite mold for large-area nanoimprint lithography[J]. Optics and precision engineering, 2018, 26(4): 894-905.
DOI：

Hong-bo LAN, Liang-le GUO, Quan XU, et al. Wafer-level composite mold for large-area nanoimprint lithography[J]. Optics and precision engineering, 2018, 26(4): 894-905. DOI： 10.3788/OPE.20182604.0894.

摘要

为了解决大面积纳米压印所面临的大尺寸晶圆级复合软模具低成本制造的难题，对于当前广泛使用的大尺寸晶圆级双层复合软模具开展了理论分析、数值模拟和制造方法的系统研究。提出并建立了复合软模具脱模过程和气泡缺陷理论模型；利用ABAQUS工程模拟软件，揭示了大尺寸复合软模具影响脱模的因素和内在规律；提出一种大尺寸晶圆级双层复合软模具低成本制造方法，并完成了10.16 cm（4 inch）满片双层复合软模具复制的实验验证。研究结果为大尺寸复合软模具制造奠定了理论基础，并提供了一种低成本高质量制造大尺寸晶圆级双层复合软模具切实可行的方法。

Abstract

In order to solve the problem of producing large-size and wafer-level composite flexible mold at low cost and high throughput for the large area NIL

this paper systematically investigated the theoretical model

numerical simulation and fabrication method for a large-size and wafer-level composite flexible mold with double-layer structures. Two models regarding the peel off demolding and the air bubble defects generated were proposed. Furthermore

the influence factors and laws of the peel demolding parameters for separating the replicated composite mold and the master mold were revealed by numerical simulation by using ABAQUS software. A manufacturing approach was presented to replicate the large size and wafer-level flexible mold with two-layer structures. Finally

a 4 inch full-wafer composite flexible mold was fabricated by using the proposed method and a 10.16 cm(4 inch) Si master. The studies in the paper are valuable in providing a theoretical basis for fabricating large-size and wafer-level composite mold

and offer a feasible and effective method to replicate large-size and wafer-level composite mold with low cost and high quality.

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Keywords

references

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Related Author

LAN Hongbo LIU Mingyang GUO Liangle XU Quan

Hong-bo LAN

Ming-yang LIU

Liang-le GUO

Quan XU

Related Institution

Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology

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