Optimization of die bond process parameters of MEMS thermopile chip

Li-guo CHEN; Yong-tao JIANG; Deng-ta NI; Min-rui WANG; Li-ning SUN

doi:10.3788/OPE.20192701.0137

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Optimization of die bond process parameters of MEMS thermopile chip

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-08-13

- Optimization of die bond process parameters of MEMS thermopile chip
- Optics and Precision Engineering Vol. 27, Issue 1, Pages: 137-145(2019)
- 作者机构：
  
  1.苏州大学机电工程学院江苏省机器人重点实验室 & 苏州纳米科技协同创新中心，江苏苏州 215021
  2.海军驻贵阳地区航空军事代表室，贵州贵阳 550000
  3.苏州工业园区纳米产业技术研究院微纳制造分公司，江苏苏州 215021
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20192701.0137
  CLC： TG494;TP24
- Received：03 May 2018，
  
  Accepted：16 July 2018，
  
  Published：15 January 2019
- 稿件说明：
移动端阅览
Li-guo CHEN, Yong-tao JIANG, Deng-ta NI, et al. Optimization of die bond process parameters of MEMS thermopile chip[J]. Optics and precision engineering, 2019, 27(1): 137-145.
DOI：

Li-guo CHEN, Yong-tao JIANG, Deng-ta NI, et al. Optimization of die bond process parameters of MEMS thermopile chip[J]. Optics and precision engineering, 2019, 27(1): 137-145. DOI： 10.3788/OPE.20192701.0137.

摘要

MEMS热电堆传感器能够实现对温度的精确测量，固晶工艺是其中关键一环，但目前尚缺乏有效方法精确优化MEMS热电堆固晶工艺参数。本文介绍了热电堆传感器的工作原理，提出了对固晶工艺参数(固晶厚度和爬胶高度)的要求。以固晶工艺要求为导向，初步探究了压力参数对固晶工艺的影响并进行了压力参数的优化。在优化的压力参数下，实验探究了点胶高度和贴片高度对固晶工艺的影响，并缩小了两参数的选择范围。在此基础上，通过有限元ANSYS软件，分析在相同温度下，不同固晶厚度的银浆与芯片接触处的热应力分布，找出最佳的固晶厚度参数，并精确优化了点胶高度和贴片高度。最后，通过实验验证的方式，对此参数下的MEMS热电堆固晶强度给出了检测结果。结果表明：压力参数为0.3 MPa、点胶高度为140 μm、贴片高度为460 μm时，固晶推力均值为43.14 N。其固晶质量最好，能够满足固晶强度要求，有助于提高MEMS热电堆芯片封装的可靠性与成品率。

Abstract

The die-bonding process is one of the key steps to ensure accurate temperature measurement by MEMS thermopile sensors. However

there remains no effective method to accurately optimize the process parameters of MEMS thermopile die-bonding. In this paper

the working principle of the thermopile sensor was introduced

and the requirements of the die-bonding process parameters-thickness and fillet height were proposed. Guided by the die-bonding process requirements

the influence of the pressure parameters on the process was initially explored

and the pressure parameters were optimized. Under optimized pressure parameters

the influence of the dispensing height and patch height on the die-bonding process was explored

and the range of choices for the two parameters was narrowed. On this basis

the finite element software package ANSYS was used to analyze the thermal stress distribution of different silver paste and chip thicknesses at the same temperature to determine the optimal die-bonding thickness and accurately optimize the dispensing height and patch height. Finally

through the experimental verification method

the test results were given for the die-bonding strength of MEMS thermopiles under these parameters. The experimental results indicate that when the pressure is 0.3 MPa

the patch height is 460 μm

and the dispensing height is 140 μm

the MEMS thermopile chip achieves average solid crystal thrust of 43.14 N. These parameters ensure the highest quality of the solid crystal

satisfy the die-bonding strength requirements

and help improve the reliability and yield of MEMS thermopile chip packages.

关键词

Keywords

references

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