Grinding of typical functional brittle materials

Ju-long YUAN; Tao-jie ZHANG; Yang LIN; Jie WANG; Wei HANG

doi:10.3788/OPE.20192705.1096

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Grinding of typical functional brittle materials

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-08-13

- Grinding of typical functional brittle materials
- Optics and Precision Engineering Vol. 27, Issue 5, Pages: 1096-1102(2019)
- 作者机构：
  
  1.浙江工业大学特种装备制造与先进加工技术教育部重点实验室，浙江杭州 310014
  2.杭州职业技术学院友嘉机电学院，浙江杭州 310018
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20192705.1096
  CLC： TG580.6;TG74
- Received：28 January 2019，
  
  Accepted：06 March 2019，
  
  Published：15 May 2019
- 稿件说明：
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Ju-long YUAN, Tao-jie ZHANG, Yang LIN, et al. Grinding of typical functional brittle materials[J]. Optics and precision engineering, 2019, 27(5): 1096-1102.
DOI：

Ju-long YUAN, Tao-jie ZHANG, Yang LIN, et al. Grinding of typical functional brittle materials[J]. Optics and precision engineering, 2019, 27(5): 1096-1102. DOI： 10.3788/OPE.20192705.1096.

摘要

为了研究典型功能脆性材料钽酸锂和硅片的磨削特性，建立了端面磨削模型来计算晶片的比磨削能及其表面的磨削力的分布，并通过实验分析脆性材料的磨削特性。以进给速度作为变量，选取砂轮端主轴磨削过程中功率增加率作为评价磨削特性的指标进行磨削实验，同时采集砂轮端主轴的功率值信号，滤波后计算晶片比磨削能和磨削力的分布。通过端面磨削模型计算可得：钽酸锂的比磨削能是147.46 J/mm

，比硅的大44%，表明磨削去除相同体积的钽酸锂需要更多的能量，钽酸锂晶片表面分布的磨削力比硅片大。磨削过程的主轴功率增加率是预测钽酸锂加工结果的重要指标，在本实验中一旦增加率大于临界值0.6 W/s，钽酸锂表面就会产生裂纹。而在相同加工条件下，无论进给速度如何变化，硅片的磨削主轴的功率增加率始终保持稳定，而钽酸锂的主轴磨削过程的功率增加率则与进给速度呈现线性增加关系，这一现象与钽酸锂的机械性质无关，而与物理性质有关系。

Abstract

To evaluate the grinding performance of typical functional brittle materials

a back-face grinding model was established and subsequently the specific energy of the wafer material and the distribution of grinding force was calculated during the grinding process according to this model. First

a series of grinding experiments were conducted at different feed rates. The rate of increase of spindle power was then chosen to evaluate the grinding performance; the recorded data of grinding power varied significantly

so it was filtered for the subsequent analysis. The experimental results indicate that the specific energy of LiTaO

(LT) is 147.46 J/mm

which is 44% larger than that of Si

and that the grinding force of LT is larger than that of Si at the same distance from the center of the wafer. The rate of increase of spindle power played a critical role in the machining of LiTaO

. It was found that

above the threshold value of 0.6 W/s

cracks were initiated and resulted in the breakdown of the wafer. Compared with the grinding of Si

spindle power in the LiTaO

grinding experiments exhibited a linear relationship with the increase in feed rate under the same experimental conditions

which indicated that the physical properties other than the mechanical properties may also play a critical role in the grinding process.

关键词

Keywords

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