Dong-xi LÜ, Ming-da CHEN, You-qiang YAO, et al. Prediction of subsurface damage depth in grinding of BK7 glass based on probability statistics[J]. Optics and precision engineering, 2020, 28(1): 102-109.
DOI:
Dong-xi LÜ, Ming-da CHEN, You-qiang YAO, et al. Prediction of subsurface damage depth in grinding of BK7 glass based on probability statistics[J]. Optics and precision engineering, 2020, 28(1): 102-109. DOI: 10.3788/OPE.20202801.0102.
Prediction of subsurface damage depth in grinding of BK7 glass based on probability statistics
In order to predict online the subsurface damage depth of the specimen induced in grinding of hard-brittle material
a theoretical relationship between the cutting force of the diamond tool and the subsurface crack depth of the specimen was established. This relationship was based on the statistical analysis of abrasive height using probability and statistics. First
based on the indentation fracture mechanics of the hard-brittle materials
the intrinsic association between the propagation depth of the median crack and the indentation depth of a single abrasive was investigated. Subsequently
the number of actual abrasives located on the boundary of the tool end-face was calculated using mathematical statistics
and the internal correlation between the cutting force of the tool and the cutting depth of each single abrasive was developed. Finally
a method for quick online prediction of the subsurface damage depth was proposed (
SSD
max
=1.284×
SSD
theo
max
-36.23)
and its accuracy was verified by an actual grinding experiment of BK7 glass. The experimental results illustrate that this technique can achieve accurate online prediction of the depth of subsurface damage involved in the grinding process.
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Formation mechanism of exit chipping in drilling hard-brittle material
Related Author
Dong-xi LÜ
Gang CHEN
De-gang ZHAO
Cong GAO
Hai-bing XU
Qi-tao GUO
Ying-dan ZHU
Related Institution
Zhejiang Provincial Key Laboratory of Robotics and Intelligent Manufacturing Equipment Technology, Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences