Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process

Meng-xia LIU; Qiang QIN; Xian-shan DONG; Jian CUI; Qian-cheng ZHAO

doi:10.3788/OPE.20202808.1715

您当前的位置：

首页 >

文章列表页 >

Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process

Micro/Nano Technology and Fine Mechanics | 更新时间：2020-08-14

- Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process
- Optics and Precision Engineering Vol. 28, Issue 8, Pages: 1715-1724(2020)
- 作者机构：
  
  1.北京大学微米/纳米加工技术国家级重点实验室, 北京 100871
  2.工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室, 广东广州 510610
- 作者简介：
- 基金信息：
- DOI：10.3788/OPE.20202808.1715
  CLC： TH703
- Received：05 January 2020，
  
  Revised：09 February 2020，
  
  Accepted：09 February 2020，
  
  Published：25 August 2020
- 稿件说明：
移动端阅览
Meng-xia LIU, Qiang QIN, Xian-shan DONG, et al. Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process[J]. Optics and precision engineering, 2020, 28(8): 1715-1724.
DOI：

Meng-xia LIU, Qiang QIN, Xian-shan DONG, et al. Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process[J]. Optics and precision engineering, 2020, 28(8): 1715-1724. DOI： 10.3788/OPE.20202808.1715.

摘要

基于硅-玻璃键合工艺实现敏感结构和衬底相接是微惯性器件的主流工艺方案之一。硅和玻璃热膨胀系数不同，在惯性器件环境工作温度发生变化时，硅玻璃接触表面会产生热应力，该应力严重影响器件的性能。为了测量异质材料间的热失配应力以及键合锚点尺寸对应力的影响，本文提出了一种以悬臂梁作为测试结构的锚点形变测量和数据处理方法，用于表征器件的工艺热失配应力。根据仿真结果将锚点设计成切块形式以减小最大应力和结构形变。测试结果表明，对于边长为600，400和200

m的锚点，悬臂梁相对锚点的平均离面位移分别为0.43，0.30和0.20 nm/℃；结果具有良好的重复性。该结果说明锚点热形变与锚点的大小直接相关，这对MEMS惯性结构以及工艺设计改进具有重要的意义。

Abstract

Silicon-glass bonding technology is critical to the development of durable micro-inertial devices. Because the thermal expansion coefficients of silicon and glass are different

thermal stress is produced on the silicon-glass contact surface when the operating temperature of the inertial device changes.This can have a serious effect on the performance of the device. Therefore

an understanding of the extent of thermal mismatch stress between these heterogeneous materials and the effect of bonding anchor point size on stress are important for the improvement of the structure and process design of these devices. In this paper

a method of anchor deformation measurement and data processing using a cantilever beam as the test structure is proposed to characterize the process thermal mismatch stress of the device. The simulation results indicate that anchor points designed in block form reduce the maximum stress and structural deformation. For anchor points with side lengths of 600

400

and 200

the average off-plane displacements of the cantilever beam relative to the anchor points are 0.43 nm/℃

0.30 nm/℃ and 0.20 nm/℃

respectively. These results have good repeatability. Our results show that the thermal deformation of anchor points is directly related to the size of the anchor points

and this has important research significance for the improvement of MEMS inertial structure and process design.

关键词

Keywords

references

N YAZDI , F AYAZI , K NAJAFI . Micromachined inertial sensors . Proceedings of the IEEE , 1998 . 86 ( 8 ): 1640 - 1659 . DOI: 10.1109/5.704269 http://doi.org/10.1109/5.704269 .

H FUJITA . Microactuators and micromachines . Proceedings of the IEEE , 1998 . 86 ( 8 ): 1721 - 1732 . DOI: 10.1109/5.704278 http://doi.org/10.1109/5.704278 .

K M KNOWLES , A T J VAN HELVOORT . Anodic bonding . International Materials Reviews , 2006 . 51 ( 5 ): 273 - 311 . DOI: 10.1179/174328006X102501 http://doi.org/10.1179/174328006X102501 .

Z C YANG . Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes . Nanolithography, MEMS, and MOEMS , 2011 . 10 ( 1 ): 011507 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=f08c74f254797b5b1055c782c94552c5 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=f08c74f254797b5b1055c782c94552c5 .

K B ALBAUGH , P E CADE , D H RASMUSSEN . Mechanisms of anodic bonding of silicon to Pyrex glass . IEEE Technical Digest on Solid-State Sensor and Actuator Workshop , 6450 . 109 - 110 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=CC024603565 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=CC024603565 .

M ESASHI . Wafer level packaging of MEMS . Journal of Micromechanics & Microengineering , 2019 . 18 ( 7 ): 073001 https://iopscience.iop.org/article/10.1088/0960-1317/18/7/073001 https://iopscience.iop.org/article/10.1088/0960-1317/18/7/073001 .

S TANAKA . Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues . Microelectronics Reliability , 2014 . 54 ( 5 ): 875 - 881 . DOI: 10.1016/j.microrel.2014.02.001 http://doi.org/10.1016/j.microrel.2014.02.001 .

J CUI , H B YANG , D LI , 等 . A silicon resonant accelerometer embedded in an isolation frame with stress relief anchor . Micromachines , 2019 . 10 ( 9 ): 571 DOI: 10.3390/mi10090571 http://doi.org/10.3390/mi10090571 .

DONG J H, QIU A P, SHI R. Temperature influence mechanism of micromechanical silicon oscillating accelerometer[C]. 2011 IEEE Power Engineering and Automation Conference, 8-9 Sept. 2011, Wuhan, China. IEEE , 2011: 385-389.

PENSALA T, JAAKKOLA A, PRUNNILA M, et al .. Temperature compensation of silicon MEMS resonators by heavy doping[C]. 2011 IEEE International Ultrasonics Symposium, 18-21 Oct. 2011, Orlando, FL, USA. IEEE , 2011: 1952-1955.

裘安萍 , 董金虎 . 硅微谐振式加速度计的温度效应及补偿 . 纳米技术与精密工程 , 2012 . 10 ( 3 ): 215 - 219 . DOI: 10.3969/j.issn.1672-6030.2012.03.005 http://doi.org/10.3969/j.issn.1672-6030.2012.03.005 .

A P QIU , J H DONG . Temperature effect and compensation of silicon resonant accelerometer . Nanotechnology and Precision Engineering , 2012 . 10 ( 3 ): 215 - 219 . DOI: 10.3969/j.issn.1672-6030.2012.03.005 http://doi.org/10.3969/j.issn.1672-6030.2012.03.005 .

FERGUSON M I, KEYMEULEN D, PEAY C, et al .. Effect of temperature on MEMS vibratory rate gyroscope[C]. 2005 IEEE Aerospace Conference, 5-12 March 2005, Big Sky, MT, USA. IEEE , 2005: 1-6.

牛海莎 , 祝连庆 , 刘宁 . 基于傅里叶变换相位提取法的激光回馈应力测量系统 . 光学精密工程 , 2018 . 26 ( 8 ): 1954 - 1959 . http://ope.lightpublishing.cn/thesisDetails?columnId=1418203&Fpath=&index=0&l=zh http://ope.lightpublishing.cn/thesisDetails?columnId=1418203&Fpath=&index=0&l=zh .

H SH NIU , L Q ZHU , N LIU . Laser feedback stress measurement system based on Fourier transform phase extraction method . Opt. Precision Eng. , 2018 . 26 ( 8 ): 1954 - 1959 . http://ope.lightpublishing.cn/thesisDetails?columnId=1418203&Fpath=&index=0&l=zh http://ope.lightpublishing.cn/thesisDetails?columnId=1418203&Fpath=&index=0&l=zh .

钱劲 , 刘澂 , 张大成 , 等 . 微电子机械系统中的残余应力问题 . 机械强度 , 2001 . 23 ( 4 ): 393 - 401 . DOI: 10.3321/j.issn:1001-9669.2001.04.005 http://doi.org/10.3321/j.issn:1001-9669.2001.04.005 .

J QIAN , LIU , D CH ZHANG , 等 . Residual stresses in micro-electro-mechanical systems . Journal of Mechanical Strength , 2001 . 23 ( 4 ): 393 - 401 . DOI: 10.3321/j.issn:1001-9669.2001.04.005 http://doi.org/10.3321/j.issn:1001-9669.2001.04.005 .

王莎莎 , 陈兢 , 栗大超 , 等 . 基于局部基底弯曲法的高灵敏度薄膜应力测试技术 . 半导体学报 , 2006 . 27 ( 6 ): 1129 - 1135 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=bdtxb200606036 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=bdtxb200606036 .

S S WANG , J CHEN , D C LI , 等 . A highly sensitive local curvature metrology for internal stress detection in thin films . Chinese Journal of Semiconductors , 2006 . 27 ( 6 ): 1129 - 1135 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=bdtxb200606036 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=bdtxb200606036 .

M STRENGTH . Micro-Raman spectroscopy and its applications to measure residual stress in micro-structure . Journal of Mechanical Strength , 2004 . 26 ( 4 ): 389 - 392 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=jxqd200404008 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=jxqd200404008 .

E BONERA , M FANCIULLI , D N BATCHELDER . Combining high resolution and tensorial analysis in Raman stress measurements of silicon . Journal of Applied Physics , 2003 . 94 ( 4 ): 2729 - 2740 . DOI: 10.1063/1.1592872 http://doi.org/10.1063/1.1592872 .

李美栓 , 辛丽 , 余家康 , 等 . 喇曼光谱方法测量金属表面氧化膜的残余应力 . 中国腐蚀与防护学报 , 1999 . 19 ( 3 ): 185 - 188 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=zgfsyfhxb199903010 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=zgfsyfhxb199903010 .

M SH LI , L XIN , J K YU , 等 . Measurements of residual stress in oxide scales by Raman spectroscopy . Journal of Chinese Society for Corrosion and Protection , 1999 . 19 ( 3 ): 185 - 188 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=zgfsyfhxb199903010 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=zgfsyfhxb199903010 .

M S BENRAKKAD , M BENITEZ , J ESTEVE , 等 . Stress measurement by micro Raman spectroscopy of polycrystalline silicon structures . Journal of Micromechanics and Microengineering , 1995 . 5 ( 2 ): 132 - 135 . DOI: 10.1088/0960-1317/5/2/019 http://doi.org/10.1088/0960-1317/5/2/019 .

刘洋 , 张天舒 , 赵雪松 , 等 . 高精度测温拉曼激光雷达光谱仪的光学设计 . 光学精密工程 , 2018 . 26 ( 8 ): 1904 - 1909 . http://ope.lightpublishing.cn/thesisDetails?columnId=1417422&Fpath=&index=0&l=zh http://ope.lightpublishing.cn/thesisDetails?columnId=1417422&Fpath=&index=0&l=zh .

Y LIU , T SH ZHANG , X S ZHAO , 等 . Optical design of high precision temperature measurement Raman lidar spectrometer . Opt. Precision Eng. , 2018 . 26 ( 8 ): 1904 - 1909 . http://ope.lightpublishing.cn/thesisDetails?columnId=1417422&Fpath=&index=0&l=zh http://ope.lightpublishing.cn/thesisDetails?columnId=1417422&Fpath=&index=0&l=zh .

熊继军 , 张文栋 , 薛晨阳 , 等 . 拉曼光谱应用于硅微悬臂梁的应力特性测试 . 中国机械工程 , 2005 . 16 ( 14 ): 1292 - 1295 . DOI: 10.3321/j.issn:1004-132X.2005.14.021 http://doi.org/10.3321/j.issn:1004-132X.2005.14.021 .

J J XIONG , W D ZHANG , CH Y XUE , 等 . Applications of Raman spectroscopy in stress performance measurement of micro-cantilever . China Mechanical Engineering , 2005 . 16 ( 14 ): 1292 - 1295 . DOI: 10.3321/j.issn:1004-132X.2005.14.021 http://doi.org/10.3321/j.issn:1004-132X.2005.14.021 .

李小雷 , 王红亮 , 曹新鑫 , 等 . 高压烧结AlN陶瓷的残余应力研究 . 功能材料 , 2018 . 49 ( 7 ): 7121 - 7124 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=gncl201807020 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=gncl201807020 .

X L LI , H L WANG , X X CAO , 等 . Residual stress of aluminum nitride ceramics sintered at high pressure . Journal of Functional Materials , 2018 . 49 ( 7 ): 7121 - 7124 . http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=gncl201807020 http://www.wanfangdata.com.cn/details/detail.do?_type=perio&id=gncl201807020 .

刘燕锋 , 陈志勇 , 张嵘 . 微机械应力测试结构的温度特性和应力抑制方法 . 光学精密工程 , 2016 . 24 ( 6 ): 1345 - 1351 . http://ope.lightpublishing.cn/thesisDetails?columnId=1813168&Fpath=&index=0&l=zh http://ope.lightpublishing.cn/thesisDetails?columnId=1813168&Fpath=&index=0&l=zh .

Y F LIU , ZH Y CHEN , R ZHANG . Temperature characteristics of MEMS stress-testing structure and a stress-suppressing method . Opt. Precision Eng. , 2016 . 24 ( 6 ): 1345 - 1351 . http://ope.lightpublishing.cn/thesisDetails?columnId=1813168&Fpath=&index=0&l=zh http://ope.lightpublishing.cn/thesisDetails?columnId=1813168&Fpath=&index=0&l=zh .

Views

806

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Strain transfer factors of pasted FBG on bending part surface

Semi-active control for structural vibration of cantilever beam based on TMS320F2812

Related Author

LI Tian-liang

TAN Yue-gang

ZHANG Xiang

WEI Lai

DONG Yan-fang

JI Hong-li

QIU Jin-hao

ZHAO Yong-chun

Related Institution

School of Mechanical and Electronic Engineering, Wuhan University of Technology

南京航空航天大学智能材料与结构航空科技重点实验室,江苏南京210016

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176855 Email：gxjmgc@ciomp.ac.cn
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰