Fully automatic gold wire bonder is the key device of the package equipment for micro-electrons

which is associated with integrating technologies of fine mechanics

automatic control

image recognition

computer application

optics and ultrasonic wave bond. By controling three-dimensional motion of the X-Y table and bond head

precision positioning and desired line-type gold wires can be realized

and an ultrasonic wave bonded method is used. The technology route is to use integrating technologies of optics and mechatronics as well as CAD/CAE to develop new products. Ultrasonic wave bond and precision position at high speed are key technologies. By means of CAD/CAE technology

The solid models of the X-Y table and bond head assembly were built

and based on the solid models

the mechanism simulation was done. By using finite element method(FEM)

the structural analysis will be done for improving design to meet the demand of bonding precision and speed.