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中南大学, 机电工程学院,湖南 长沙,410083
收稿日期:2004-08-10,
修回日期:2004-10-28,
网络出版日期:2004-12-15,
纸质出版日期:2004-12-15
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刘德福, 段吉安. 光纤端面研磨加工机理研究[J]. 光学精密工程, 2004,(6): 570-575
LIU De-fu, DUAN Ji-an. Mechanism research on lapping of optical fiber end-face[J]. Editorial Office of Optics and Precision Engineering, 2004,(6): 570-575
给出了研磨光纤时的材料去除机理
选用粒度为微米及亚微米级的金刚石磨料砂纸
在研磨压力为0.48Mpa时
在KE-OFP-12型光纤连接器研磨机上对光纤端面进行了研磨实验.结果表明:光纤研磨加工的材料去除存在脆性断裂、半脆性半延性、延性等3种模式.材料去除模式主要取决于磨料的平均粒度
磨料粒度为3μm时
为脆性断裂到延性研磨的临界转换点.并从理论上对结果进行了分析
光纤以延性模式研磨加工时
光纤表面粗糙度Ra可达到纳米级
其表面看不到任何划痕
而光纤以脆性断裂模式研磨加工时
其表面粗糙度只能达到亚微米级
证明材料以延性模式去除是提高光纤表面质量的有效方法.
The material removal mechanism in optical fiber lapping is presented. With diamond lapping-film whose abrasive grain size is from micron to sub-micron
when the nominal lapping pressure was 0.48 MPa
the optical fiber end-face lapping experiment was conducted on optical fiber connector lapping machine of KE-OFP-12. The experiment results show that there are three material removal modes during lapping optical fiber
i.e. brittle fracture mode
semi-brittle and semi-ductile mode
and ductile mode. These modes are mainly controlled by abrasive grain size; there appears brittle-ductile transition's critical point when the lapping-films whose abrasive grain size is 3 μm is used to lap optical fiber. And these material modes are analyzed theoretically. The surface roughness can reach nanometer grade and there are not any scratches and cracks on the fiber end-face when fiber material is removed by ductile mode; and only sub-micron grade surface roughness can be gotten when fiber material is removed by brittle fracture mode. It proves that the ductile lapping mode is an effective method that improves surface quality of fiber end-face.
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