微热板式气压传感器结构设计与热分析

张凤田; 唐祯安; 高仁璟; 金仁成; 郭文泰; 王海霞

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微热板式气压传感器结构设计与热分析

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- 微热板式气压传感器结构设计与热分析
- Design and thermal analysis of gas pressure sensor with micro-hotplate
- 光学精密工程 2004年12卷第6期页码：598-602
- 作者机构：
  
  大连理工大学, 电子工程系, 微系统研究中心,辽宁大连,116024
- 作者简介：
- 基金信息：
  
  国家自然科学基金资助项目(No.90207003)()
- DOI：
  中图分类号： TP212
- 收稿日期：2004-09-22，
  
  修回日期：2004-11-11，
  
  网络出版日期：2004-12-15，
  
  纸质出版日期：2004-12-15
- 稿件说明：
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张凤田, 唐祯安, 高仁璟, 金仁成, 郭文泰, 王海霞. 微热板式气压传感器结构设计与热分析[J]. 光学精密工程, 2004,(6): 598-602

ZHANG Feng-tian, TANG Zhen-an, GAO Ren-jing, JIN Ren-cheng, GUO Wen-tai, WANG Hai-xia. Design and thermal analysis of gas pressure sensor with micro-hotplate[J]. Editorial Office of Optics and Precision Engineering, 2004,(6): 598-602
张凤田, 唐祯安, 高仁璟, 金仁成, 郭文泰, 王海霞. 微热板式气压传感器结构设计与热分析[J]. 光学精密工程, 2004,(6): 598-602 DOI：

ZHANG Feng-tian, TANG Zhen-an, GAO Ren-jing, JIN Ren-cheng, GUO Wen-tai, WANG Hai-xia. Design and thermal analysis of gas pressure sensor with micro-hotplate[J]. Editorial Office of Optics and Precision Engineering, 2004,(6): 598-602 DOI：

摘要

给出了采用牺牲层技术制作的微热板式气压传感器的加工工艺和工作原理.分析了微热板各层薄膜厚度、微热板下气隙高度、支撑桥尺寸、微热板面积大小对传感器加工、工作性能的影响

并结合实际工艺条件设计了一种采用不同支撑桥尺寸的传感器结构.理论分析了恒温加热方式下微热板各种传热途径随气压的变化关系;用有限元方法模拟了恒流加热方式下气压对传感器温度分布和温度大小的影响.分析结果显示

气压较高时微热板传热以气体导热为主

而气压较低时以支撑桥导热为主;微热板区域温度分布较均匀

温度大小受气压影响较大;设计的传感器测量范围为10～10

功耗在毫瓦级

且具有尺寸小、热响应快、易与电路集成等优点.

Abstract

Fabrication process and working principle of thermal gas pressure sensors based on a surface-machining micro-hotplate(MHP)are presented. The effects of dimensions of MHP

gas gap

and supporting beams on fabrication and working performance of the sensor are analyzed

and a new sensor structure with unequal beams is designed. Three heat transfer approaches of MHP including conduction through the supporting beams

thermal radiation

and gas conduction

and their variation with gas pressure under constant temperature operation are investigated in theory. Temperature distribution and its amplitude of the sensor under constant current excitation are simulated with finite element method. The results show that heat loss of MHP is mainly determined by gas conduction in high pressure range

while conduction through the supporting beams dominates in low pressure range. Temperature distribution of MHP is uniform and its amplitude depends on pressure. The designed device can be operated from 10 Pa to 10~5 Pa and its power consumption is at the level of milliwatts. It also has other advantages

such as being small in size

fast thermal response

and ease of integration with circuits

etc.

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Keywords

references

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