A fabricating technology for high energy density micro electromagnetic actuator based on Micro Electron Mechanics System(MEMS) is introduced. The main steps on MEMS technology are as follows: Firstly

etching plating trenches of multi-turn double planar microcoils and permalloy (NiFe) core into silicon wafers prior to electrode position

a seed layer of copper must is deposited on the wafer; secondly

when the thick of seed layer reaches to about 20 μm by electroplating

peeling the surface plating on the wafer and coating the core by photoresist

electroplating the coil in the groove; thirdly

when the coil groove is filled with copper

coating the coils and electroplating permally core. In the 10 mm×10 mm×0.38 mm square silicon wafer

a high energy density electromagnetic microactuator

composed of multi-turn double planar microcoils (22×2 turns

section of copper wire is 60 μm×60 μm

length is 1 164 mm) and permalloy core (3 mm×3 mm×0.2 mm)

is fabricated. Finally

the estimated force produced by the integrated electromagnetic microactuator is around 50 mN at a sinusoidal current amplitude of 0.3 A

which is fabricated and tested on the valveless micropump. Experiment results show the microactuator is efficient in producing large magnetic force and flexible in application.