In order to realize nano-scale ultra-smooth machining for silicon wafers

a hydrodynamic suspension machining system based on robot was established

and the nanometer SiO

2

suspension liquid with good dispersibility and stability was developed. By conducting experiments

the correlation between the surface roughness of workpiece and the machining time

motor rotate speed

density of abrasive particles were revealed. Experimental results indicate that the machining effects are the best when the machining time

motor rotate speed and density of abrasive particle are 60 min/s

6 000 r/min and 30 g/L

respectively. The surface roughness after machining can be 1.55 nm. Based on the conducting experiments

the machining mechanism was analyzed. The results show that the hydrodynamic suspension ultra-smooth machining for silicon wafers is the combination of mechanical impacting and chemical function. The nano-scale ultra-smooth surface of silicon wafers can be realized after hydrodynamic suspension machining and high quality surfaces without plastic deformation and damage are achieved.