In order to find out basis factors related with metal electrocrystallization of cathode and to take adequate measures to control electrode process of cathode

the electrode process kinetics of micro-electroforming was studied. Under provided composition of electroforming solution and technology course conditions

the electrode process kinetics of micro-electroforming Ni structure was studied by AC impedance method. The equivalent circuit of micro-electroforming system was presented. Then

the influence of agitation and leveling agent on impedance of electroforming system was analyzed based on AC impedance chart and resistance reactance frequency response. Finally

the kinetic parameter

exchange current density in electrode process was calculated. The results show that the optimization amount of leveling agent is 3 g/L by measuring impedance of solution

exchange current density is 0.171 A/dm

2

under agitation and optimization amount of leveling agent conditions. The impedance of solution is decreased

and the current efficiency of cathode is increased while agitating micro-electroforming solution and using leveling agent

it can improve surface performance

tightness and uniformity of Ni microstructure.