The influence of different processing parameters on the warpage and deformation of a 11 mm×3 mm×0.8 mm light guide plate with microstructure array was simulated by the MoldFlow MPI5. The optimized parameter of each factor’s contribution to the light guide plate with microstructure array was studied with orthogonal experimental method

and then the single factor experimental method was utilized to study the effect of different processing parameters on the warpage and deformation of the light guide plate with microstructure array. The results show that holding pressure contributes the most to the warpage and deformation (60.19%)

and the injection time is the second one (13.13%). The single factor experimental simulation shows that the influence degree of process parameters on warpage can be ordered in pressure> injection time >holding time>melt temperature>cooling time. Therefore

the influence of different processing parameters on the injection molding of the light guide plate should be considered in priority

especially the holding pressure’s setting.