This paper investigates the thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures as a function of electroplating conditions. Factors which influence the thickness uniformity of microstructures were discussed. It was found that the thickness uniformity and the cross-sectional profiles of microstructures could be controlled by varying the process conditions. When no additives in electroplating solution

the polarizability were applied to explain the changes in the thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures; with additive

coexisting adsorption states of additive in electroplating is believed to be responsible for the change in the thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures. At last

a uniform thickness distribution and microstructures with flat profiles could be obtained at optimal plating conditions of 6±2mA/cm2 and 25°C.