The interface between neurons and electrodes is one of the key issues in implantable microdevices and bioelectronics. However

the traditional sandwich-type planar mciroelectrtode arrays are not well suited for effectively stimulating or recording due to no tight contact between the neuron and the planar electrode. To overcome this problem

we proposed a method to fabricate the flexible 3D protruding microelectrode arrays (MEAs) for neural applications. A photosensitive polyimide (Durimide 7510) was used as substrate materials

and the MEAs with the structure of pyramide-shaped microelectrode was fabricated by the procedures of wet etching

photolithography

lift-off

electrochemical etch release and so on. The pyramid-shaped electrode configuration allows electrode sites to get closer to target neurons. A comparison between the planar and 3D protruding electrode configuration was performed by simulaiton and resistance test. The results show that a better stimulation can be obtained with the 3D electrode devices.