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东莞理工学院
收稿日期:2008-01-24,
修回日期:2008-03-28,
网络出版日期:2008-08-25,
纸质出版日期:2008-08-25
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卢盛林,张宪民. PCB无铅焊点检测的光源分析与优化设计[J]. 光学精密工程, 2008,16(8):1377-1383
Analyze and Optimal Design of Illuminator for Leadless Tin Solder Joint Inspection[J]. Optics and precision engineering, 2008, 16(8): 1377-1383.
卢盛林,张宪民. PCB无铅焊点检测的光源分析与优化设计[J]. 光学精密工程, 2008,16(8):1377-1383 DOI:
Analyze and Optimal Design of Illuminator for Leadless Tin Solder Joint Inspection[J]. Optics and precision engineering, 2008, 16(8): 1377-1383. DOI:
为了提高自动光学检查(AOI)系统的性能,应对无铅化制程的需要,本文对AOI光源进行了研究。首先,介绍了AOI光源的结构设计方法,光源由红、绿、蓝3种不同颜色,不同照射角度的LED阵列组成。然后,建立了光源的照度模型以及焊点的反射模型。最后,根据简化的照度模型对光源的几何参数进行了优化。仿真和实验结果验证了光源设计的有效性。
This paper presents an illuminator for Leadless tin solder joint inspection. Firstly
the structure of the designed illuminator is introduced. Secondly
the radiance model of the illuminator and the irradiance model of the solder joint are developed. Thirdly
the dimensions of the illuminator are optimized based on the irradiance model. Finally
the simulation and experimental results verify the validity of the design.
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