According to the in-line inspection requirements of the surface mounted IC (integrated circuit) components

an inspection algorithm based on the edge integral projection and color statistical features was presented. Firstly

the feature of the IC components under three colors (red

greed

blue) structure light source was analyzed. Secondly

the horizontal and vertical edges were extracted with the Sobel arithmetic operator. Based on the integral projection of the edges

the horizontal and vertical borders of the IC leads were obtained by the maximum neighbor gradient and the sliding filter window algorithm

respectively. After location the leads

the defects such as missing components

wrong components

shifts and skews were inspected. Finally

the statistical color features in HSI (Hue

Saturation

intensity) space were extracted to inspect the defects of leads lift and wrong polarity. Experiment results show that the proposed method can identify the defects of the IC components effectively. The total success rate was high while the speed was fast.