Based on a novel thermal stress mechanism and an online-forming technology
the FBG strain sensor was designed and manufactured. This sensor cannot only compensate temperature drift but enhance stain sensitivity. This package method solves the glue-aging problem to a certain extent and a problem being unable to test stain. The results are as follows: this package was shown to have a near zero shift and a high strain sensitivity of 1.7pm/με in this proposed self-compensated package