Taguchi robust design method is applied to the design of silicon roof-like microchannel heat sinks. Orthogonal experiments are designed and signal-noise ratios calculated to carry out the robust optimization of key parameters. Laser diode bars are welded on a prototype heat sink to test its thermal resistance. The active region temperature rise of the middle bar is estimated using the temperature coefficient of GaAs laser wavelength. Experimental results show that the thermal resistance per unit area is 0.070 K

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8226;cm2/W

which agrees with that calculated with the finite element method.