Micro-electroforming is a key technology of UV-LIGA. It plays an important part in MEMS technology and micro-nano manufacture. In order to explore the inherent laws of micro-electroforming

the cathode current density and the fluid field relevant to the growth of electroforming layer is studied with numerical simulation method. Taken the micro-mold of micro-fluidic chip as the research object

the mathematical model is established. The current density and the fluid field are described with partial differential equation separately. Then the 3D numerical simulation of the micro-electroforming model has been performed with the finite element method. The simulated result of current density distribution and the fluid field distribution is gotten. Chosen measuring points in crossing electroforming layer

the simulated growth height during 4 hour electroforming may be calculated based on the simulated data of the current density and the velocity of fluid at the measuring points. Finally

the simulated growth height of electroforming layer is compared with growth height got from the micro-electroforming experiment under the same technological condition. The result indicated that the trend of the simulated growth height of electroforming layer is similar to the experimental growth height to corresponding measuring points. The absolute deviation between simulated growth height and the corresponding experimental growth height is low. The maximum deviation is 4.437μm

the minimum deviation is 0.264μm. The kind of method may be used aided technology analysis and design in micro-electroforming

and may reduce the developing time of micro-electroforming technology.