Study on the novel process of reducing subsurface damage in grinding by Magnetorheological Finishing[J]. Optics and precision engineering, 2010, 18(1): 162-168.
Study on the novel process of reducing subsurface damage in grinding by Magnetorheological Finishing[J]. Optics and precision engineering, 2010, 18(1): 162-168.DOI:
Based on the low subsurface damage in Magnetorheological Finishing (MRF) process
a novel optical machining process is introduced to continue with grinding by MRF rather than lapping. Experimental research on this novel process
reducing subsurface damage caused by grinding by MRF
is finished with KDMRF-1000F polishing machine and KDMRW-2 water based MR fluids. One K9 flat (100mm in diameter) is rough polished (depth 50um
156min) and surface roughness Ra is 0.926nm. Then
it is finishing polished (depth 200nm
17.5min) to remove the ripples caused by rough polish and final surface roughness Ra is 0.575nm. The result shows that MRF is a low subsurface damage deterministic process
which results in high surface roughness (below 1nm)
low subsurface damage and high machining efficiency.