In order to realize the thermal control of high-power focal plane apparatus (FPA)

the thermal design of FPA is studied based on the method of simulation and experiment according to the structure characteristics of the FPA. First of all

the main requirements of the thermal design of high-power focal plane apparatus are introduced and the feature of thermal design of focal plane assembly was analyzed. Then

the thermal performance is simulated by means of code TMG. The thermal test is conducted and the fit curve of temperature of FPA according to the thermal test is given. Finally

how to choosing the thermal control mode rationally is put forward according to thermal design example. The results show that the temperature of 50W high-power FPA can be controlled lower than 35℃ when it is worked in 2 minutes continuously and have the 12℃ cool source. It can meet the design requirements of FPA.