激光烧结导电线路的气孔抑制

陈天宇; 顾明飞

doi:10.37188/OPE.20202809.1958

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激光烧结导电线路的气孔抑制

现代应用光学 | 更新时间：2020-09-28

- 激光烧结导电线路的气孔抑制
- Stoma suppression of laser sintering conductive circuit
- 光学精密工程 2020年28卷第9期页码：1958-1966
- 作者机构：
  
  南京理工大学机械工程学院, 江苏南京 210094
- 作者简介：
  
  [ "陈天宇(1996-), 男, 江苏江阴人, 硕士研究生, 主要从事激光烧结银浆成形导电线路性能方面的研究。E-mail:cty15061772687@sina.com" ]
  [ "顾明飞(1996-), 男, 江苏盐城人, 博士生研究生, 2017年于南京理工大学获得学士学位, 主要从事激光烧结成形三维电路材料、工艺方面的研究。E-mail:gmf761220@outlook.com" ]
- 基金信息：
  
  国家重点研发计划资助项目(2017YFB110300);江苏省重点研发计划资助项目(BE2018010)
- DOI：10.37188/OPE.20202809.1958
  中图分类号： TN249
- 收稿日期：2020-03-10，
  
  修回日期：2020-04-29，
  
  录用日期：2020-4-29，
  
  纸质出版日期：2020-09-25
- 稿件说明：
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陈天宇, 顾明飞. 激光烧结导电线路的气孔抑制[J]. 光学精密工程, 2020,28(9):1958-1966.

Tian-yu CHEN, Ming-fei GU. Stoma suppression of laser sintering conductive circuit[J]. Optics and precision engineering, 2020, 28(9): 1958-1966.
陈天宇, 顾明飞. 激光烧结导电线路的气孔抑制[J]. 光学精密工程, 2020,28(9):1958-1966. DOI： 10.37188/OPE.20202809.1958.

Tian-yu CHEN, Ming-fei GU. Stoma suppression of laser sintering conductive circuit[J]. Optics and precision engineering, 2020, 28(9): 1958-1966. DOI： 10.37188/OPE.20202809.1958.

摘要

针对激光烧结导电线路内部会产生大量气孔阻碍导电性能进一步提升的问题，通过单因素试验研究工艺参数对导电线路形貌变化的影响规律，明确导电线路的烧结特性后提出了变参数的烧结方法来抑制气孔成形。该方法首先依据烧结导电线路时发生的形貌变化来选取满足条件的烧结参数，然后通过单因素试验确定最优烧结方式，最后检测最优方式烧结后导电线路的气孔情况和微观组织来验证和分析该方法的有效性。结果表明，激光功率显著影响导电线路的形貌变化，低功率烧结时导电线路体积收缩，高功率烧结时导电线路体积膨胀，基于导电线路烧结特性形成的最优烧结方式不仅能够有效抑制气孔成形，而且提高了35.6%的导电性能。该研究基于烧结工艺方法来获得气孔较少、导电性能良好的导电线路，对电子产品中成形质量优良的导电线路具有积极意义。

Abstract

To reduce the large number of stoma generated inside a conductive circuit during laser sintering

which impede further improvements in conductivity

a single factor test was conducted to study the influence of process parameters on the morphology change of a conductive circuit. Once the sintering characteristics of the conductive circuit were determined

a sintering method with variable parameters was proposed to suppress the formation of stoma. The proposed method first selects the sintering parameters that meet the requirements according to the morphological change of the conductive circuit

then determines the optimal sintering method through the single-factor test method. Finally

the stoma and microstructure of the conductive circuit sintered by the optimal method are detected and the effectiveness of the method is analyzed. The results show that laser power significantly affects the morphology of the conductive circuit; the volume of the conductive circuit shrinks during low-power sintering and expands during high-power sintering. The optimal sintering method

based on the sintering characteristics of the conductive circuit

effectively suppresses the formation of stoma

improving the conductivity by 35.6%. The results of this study

based on a sintering process that yielded a conductive circuit with fewer stoma and increased conductivity

are significant for conductive circuit performance and can confer excellent forming qualities to electronic products.

关键词

Keywords

references

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