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南京航空航天大学 江苏省精密与微细制造技术重点实验室,江苏 南京,210016
收稿日期:2009-10-09,
修回日期:2009-11-26,
网络出版日期:2010-08-20,
纸质出版日期:2010-08-20
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胡洋洋, 朱 荻, 李寒松. 采用过电铸工艺制造金属微细阵列网板[J]. 光学精密工程, 2010,18(8): 1793-1800
HU Yang-yang, ZHU Di, LI Han-song. Fabrication of metal micro hole array by using over-plating technology[J]. 光学精密工程, 2010,18(8): 1793-1800
胡洋洋, 朱 荻, 李寒松. 采用过电铸工艺制造金属微细阵列网板[J]. 光学精密工程, 2010,18(8): 1793-1800 DOI: 10.3788/OPE.20101808.1793.
HU Yang-yang, ZHU Di, LI Han-song. Fabrication of metal micro hole array by using over-plating technology[J]. 光学精密工程, 2010,18(8): 1793-1800 DOI: 10.3788/OPE.20101808.1793.
针对制作尺度
<
10 m的超小微细阵列网板非常困难的问题
提出了采用过电铸工艺制造超小尺寸微细阵列网板的方法。建立了过电铸工艺过程的电场模型
利用有限元分析技术对过电铸工艺过程进行模拟仿真。选取优化的工艺参数(烘胶 120 ℃/60 min
曝光 3 000 mJ/cm
2
显影 2 min等)利用光刻制作了高度为50 m、直径为50 m的AZ EXP 125nXT-10A光刻胶群柱结构
以此胶膜结构作为模具进行了过电铸工艺实验
并与仿真结果进行对比
结果证明了有限元仿真的正确性。最后
通过过电铸缩孔2 h获得了厚度达70 m
孔径为4 m的微细阵列网板结构。实验表明
过电铸工艺是一种低廉、安全、可批量生产的制作超小阵列网板的方法。
The over-plating technology was introduced to fabricate micro hole arrays
for it is difficult to fabricate a micro hole array with the size less than 10 m by traditional methods. A mathematical model was presented to simulate the over-plating process by Finite Element Method (FEM). Using the optimized parameters (bake 120 ℃/60 min
exposure 3 000 mJ/cm
2
and development 2 min)
the AZ EXP 125nXT-10A resist structure in a diameter of 50 m and a height of 50 m was prepared
and then the over-plating technology was employed to shrink the micro hole. The experimental result shows that the simulation result is correct. Finally
a micro hole array in a diameter of 4 m and a height of 70 m was fabricated after over-plating 2 h. The result indicates that over-plating is a simple and low cost method to fabricate micro hole array
and it is suitable for batch production.
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