常温微压印中抗蚀剂流动的研究及工艺优化

魏正英; 熊孝东; 杜 军; 丁玉成

doi:10.3788/OPE.20101808.1822

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常温微压印中抗蚀剂流动的研究及工艺优化

微纳技术与精密机械 | 更新时间：2020-08-12

- 常温微压印中抗蚀剂流动的研究及工艺优化
- Flow behavior of resist in room-temperature micro-imprinting and its process optimization
- 光学精密工程 2010年18卷第8期页码：1822-1832
- 作者机构：
  
  西安交通大学机械制造系统工程国家重点实验室,陕西西安,710049
- 作者简介：
- 基金信息：
  
  国家自然科学基金资助项目(No.50975227)();全国博士学位论文作者专项资金资助项目(No.200740)();国家自然基金重大研究计划资助项目(No.9092
- DOI：10.3788/OPE.20101808.1822
  中图分类号： TN305.7
- 收稿日期：2009-11-20，
  
  修回日期：2009-12-28，
  
  网络出版日期：2010-08-20，
  
  纸质出版日期：2010-08-20
- 稿件说明：
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魏正英, 熊孝东, 杜军, 丁玉成. 常温微压印中抗蚀剂流动的研究及工艺优化[J]. 光学精密工程, 2010,18(8): 1822-1832

WEI Zheng-ying, XIONG Xiao-dong, DU Jun, DING Yu-cheng. Flow behavior of resist in room-temperature micro-imprinting and its process optimization[J]. 光学精密工程, 2010,18(8): 1822-1832
魏正英, 熊孝东, 杜军, 丁玉成. 常温微压印中抗蚀剂流动的研究及工艺优化[J]. 光学精密工程, 2010,18(8): 1822-1832 DOI： 10.3788/OPE.20101808.1822.

WEI Zheng-ying, XIONG Xiao-dong, DU Jun, DING Yu-cheng. Flow behavior of resist in room-temperature micro-imprinting and its process optimization[J]. 光学精密工程, 2010,18(8): 1822-1832 DOI： 10.3788/OPE.20101808.1822.

摘要

为提高微压印中抗蚀剂的复型精度

利用POLYFLOW

基于流固耦合方法对常温压印过程中抗蚀剂的流动进行了有限元模拟

系统地分析了抗蚀剂的初始厚度

留膜厚度

模具的深宽比

占空比

模具下压速度等因素对抗蚀剂流动填充的影响规律。搭建了压印的可视化实验平台

通过该平台对不同工艺条件(包括抗蚀剂的初始厚度

留膜厚度以及模具的下压速度)及软模具结构(深宽比

占空比)下抗蚀剂的流动填充过程及其填充形貌进行了实时观测

并与数值计算结果进行比较。结果表明

在不影响填充效率的情况下

采用低速下压(1 m/s)方式

在占空比>0.375

深宽比<2时

填充度可达到90%以上。仿真和实验验证了优化的压印工艺条件和模具结构。另外

本文还引入了增加模板特征高度预留量的概念

可进一步提高复型精度。

Abstract

To improve the replicating precision of resist in micro-imprinting

the POLYFLOW was used to simulate its flow behavior in room-temperature micro-imprinting based on the Fluid-Solid-Interaction(FSI) method.The effects of the initial thickness and residual thickness of the resist

the ratio of height to width and duty ratio of the mold

and the imprinting velocity of the mold on the resist flow behavior in a cavity were analyzed systematically. A platform of visual experiments was established

and the process of micro-imprinting and the profile of resist in different technological conditions were observed. Comparing the experimental results to the simulation results

it is concluded that the filling rate can come up to 90% when the imprinting velocity is slower than 1 m/s

the duty ratio is more than 0.375

and the ratio of height to width is less than 2. Obtained results show that the imprinting process condition and the structure of the mold have been optimized and the replicating precision can be improved by the optimized results.

关键词

Keywords

references

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