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南京理工大学 MEMS惯性技术研究中心,江苏 南京,210094
收稿日期:2010-07-21,
修回日期:2010-08-26,
网络出版日期:2011-04-26,
纸质出版日期:2011-04-26
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石然, 姜劭栋, 裘安萍, 苏岩. 微杠杆在硅微谐振式加速度计中的应用[J]. 光学精密工程, 2011,19(4): 805-811
SHI Ran, JIANG Shao-dong, QIU An-ping, SU Yan. Application of microlever to micromechanical silicon resonant accelerometers[J]. Editorial Office of Optics and Precision Engineering, 2011,19(4): 805-811
石然, 姜劭栋, 裘安萍, 苏岩. 微杠杆在硅微谐振式加速度计中的应用[J]. 光学精密工程, 2011,19(4): 805-811 DOI: 10.3788/OPE.20111904.0805.
SHI Ran, JIANG Shao-dong, QIU An-ping, SU Yan. Application of microlever to micromechanical silicon resonant accelerometers[J]. Editorial Office of Optics and Precision Engineering, 2011,19(4): 805-811 DOI: 10.3788/OPE.20111904.0805.
从基于DDSOG(Deep Dry Silicon on Glass)工艺的硅微谐振式加速度计样机入手
阐述了加速度计中微杠杆结构对惯性力的放大作用
证明了标度因数与系统放大倍数
n
为正比关系
并以加速度计样机中的单级微杠杆为例
建立了加速度计的理论模型。推导了微杠杆的放大倍数A和轴向刚度K的计算公式
以此为基础导出了加速度计系统放大倍数n的计算方法。依据公式计算得到加速度计样机的系统放大倍数n的理论值为21.820
并用有限元方法对理论值进行了仿真验算
得出
n
的仿真值为19。最后对加速度样机进行了实际测试
测得加速度计的标度因数为127.33 Hz/
g
系统放大倍数
n
为25.466。对所得结果的比较表明
系统放大倍数的理论值与仿真值及实验值的误差分别为14.8%和14.3%
误差在可接受范围内。
A micromechanical Silicon Resonant Accelerometer (SRA) prototype fabricated by Deep Dry Silicon on Glass (DDSOG) process was presented. The amplification of single-stage microlever in the SRA to the interial force was researched
then it pointed out that the scale factor of SRA is proportional to the system amplification factor
n
.The theoretical model of single-stage microlever in SRA was established
and the formulas for microlever amplification factor
A
and axial stiffness
K
were derived. On this base
the formula for system amplification factor
n
was also derived. According to the formula
the theoretical value of system amplification factor
n
for SRA prototype is calculated to be 21.820. As a comparison
its simulation value of 19 is also achieved by the Finite Element Analysis (FEA). The practical test for the SRA prototype was performed
which shows that the scale factor of the SRA is 143 Hz/
g
and the system amplification factor is 25.466. As compared with the theoretical value
the errors of simulation and test results are 14.8% and 14.3%
respectively
which are within the accepta- ble range.
KELLER C G, HOWE R T. Nickel-filled hexsil thermally actuated tweezers . The 8th International Conference on Solid-State Sensors and Actuators, Stockholm, 1995:376-379.[2] ROESSIG T A, HOWE R T, PISANO A P, et al.. Surface-micromachined resonant accelerometer .1997 International Conference on Solid-State Sensors and Actuators, Chicago,1997,6:859-862.[3] SU X P S, YANG H S, AGOGINO A M. A resonant accelerometer with two-stage microleverage mechanisms fabricated by SOI-MEMS technology [J]. IEEE Sensors Journal, 2005,5(6):1214-1223.[4] 裘安萍,庄瑞芬,施芹. 硅微谐振式加速度计结构设计与仿真[J]. 中国惯性技术学报,2009,17(1):93-97. QIU A P, ZHUNG R F, SHI Q. Structure design and simulation of micromechanical silicon oscillating accelerometer[J]. Journal of Chinese Inertial Technology, 2009,17(1):93-97.(in Chinese)[5] ROESSIG T A. Integrated MEMS tuning fork oscillators for sensor applications . Berkeley: University of California, UMI, 1998.[6] SU X P S. Compliant leverage mechanism design for MEMS application . Berkeley: University of California, Spring, 2001.[7] 裘安萍,苏岩,施芹,等. 硅微振梁式加速度传感器中微杠杆结构的设计[J]. 传感技术学报,2006,19(5):2204-2207. QIU A P, SU Y, SHI Q. Micro leverage design for micromechanical silicon oscillating accelerometer [J]. Chinese Journal of Sensors and Actuators, 2006,19(5):2204-2207.(in Chinese)[8] SU X P S, YANG H S. Design of compliant microleverage mechanisms [J]. Sensors and Actuators A, 2001,87:146-156.[9] 施芹,裘安萍,苏岩,等. 硅微机械陀螺仪的机械耦合误差分析 [J]. 光学 精密工程,2008,16(5):893-898. SHI Q, QIU A P, SU Y, et al.. Mechanical coupling error of silicon microgyroscope [J]. Opt. Precision Eng., 2008,16(5):893-898.(in Chinese)[10] WOJCIECHOWSKI K E, BOSER B E, PISANO A P. A MEMS resonant strain sensor operated in air . Proc. 17th Int. IEEE Micro Electro Mech. Syst. Conf., 2004,1:841-845. [11] 李建利,房建成,盛蔚,等. 双质量块调谐输出式硅MEMS陀螺仪 [J]. 光学 精密工程,2008,16(3):484-491. LI J L, FANG J CH, SHENG W, et al.. Calculation and simulation of silicon MEMS gyroscope with dual-mass resonant output [J]. Opt. Precision Eng., 2008,16(3):484-491.(in Chinese)[12] 施芹,苏岩,裘安萍,等. MEM陀螺仪器件级真空封装技术 [J]. 光学 精密工程,2009,17(8):1987-1992. SHI Q, SU Y, QIU A P, et al.. Device level vacuum packaging technologies of MEMS gyroscopes [J]. Opt. Precision Eng., 2009,17(8):1987-1992.(in Chinese)
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