空间光谱成像仪热设计及其分析与验证

郭亮; 吴清文; 颜昌翔

doi:10.3788/OPE.20111906.1272

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空间光谱成像仪热设计及其分析与验证

现代应用光学 | 更新时间：2020-08-12

- 空间光谱成像仪热设计及其分析与验证
- Thermal design of space spectral imaging apparatus and its analysis and verification
- 光学精密工程 2011年19卷第6期页码：1272-1280
- 作者机构：
  
  1. 中国科学院长春光学精密机械与物理研究所,吉林长春,中国,130033
  2. 中国科学院研究生院北京,100039
- 作者简介：
- 基金信息：
  
  国防预研基金资助项目(No.O5001SA050)()
- DOI：10.3788/OPE.20111906.1272
  中图分类号： TP73;V243.5
- 收稿日期：2010-09-26，
  
  修回日期：2010-10-27，
  
  网络出版日期：2011-06-25，
  
  纸质出版日期：2011-06-25
- 稿件说明：
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郭亮, 吴清文, 颜昌翔. 空间光谱成像仪热设计及其分析与验证[J]. 光学精密工程, 2011,19(6): 1272-1280

GUO Liang, WU Qing-wen, YAN Chang-xiang. Thermal design of space spectral imaging apparatus and its analysis and verification[J]. Editorial Office of Optics and Precision Engineering, 2011,19(6): 1272-1280
郭亮, 吴清文, 颜昌翔. 空间光谱成像仪热设计及其分析与验证[J]. 光学精密工程, 2011,19(6): 1272-1280 DOI： 10.3788/OPE.20111906.1272.

GUO Liang, WU Qing-wen, YAN Chang-xiang. Thermal design of space spectral imaging apparatus and its analysis and verification[J]. Editorial Office of Optics and Precision Engineering, 2011,19(6): 1272-1280 DOI： 10.3788/OPE.20111906.1272.

摘要

为确保空间光谱成像仪的温度水平和温度梯度满足指标要求

分析讨论了空间光谱成像仪整机热设计的特点

根据其结构特点和导热路径

给出了整机热设计方案。采用有限元数值分析方法

建立了整机热平衡方程和热分析计算模型

应用有限元热分析软件IDEAS-TMG在给定温度边界条件下进行稳态仿真分析

给出了整机热响应性能以及关键部件稳态温度分布云图。热分析结果表明

整机平均温度水平为17.3~23.7 ℃

温度梯度最大值为1.3 ℃

获得的分析结果能够满足热控指标要求

为提高整机的可靠性和热设计优化提供了理论依据。最后

通过试验对热设计方案进行了验证

验证结果与数值分析结果吻合较好

其最大偏差均不超过8%

验证了数值分析的正确性和温度预示的有效性。试验过程中整机平均温度水平为17.2~22.5 ℃

温度梯度最大值为1.4 ℃。

Abstract

To ensure a proper averaged temperature and a temperature gradient of a space spectral imaging apparatus

the characteristics of thermal design for the space spectral imaging apparatus were discussed and analyzed. According to the design feature and the heat transfer path in the spectral imaging apparatus

a thermal design scheme for the apparatus was presented and the thermal equilibrium equation and a numerical analysis model of the heat transfer for the apparatus were established by finite element analysis method. Based on given temperature boundary conditions

the steady-state thermal analysis of the apparatus was carried out through a finite element thermal analysis software IDEAS-TMG. The thermal response performance and steady-state temperature profiles of key parts in the apparatus were given.Thermal analysis shows that the averaged temperature value and maximum temperature gradient value of the apparatus in steady-state are 17.3~23.7 ℃ and 1.3 ℃

which has met the requirements of heat control

and can supply a theoretical warrant for reliability and optimization of thermal design. Thermal design scheme was also verified through a thermal test and obtained results are well coincident with that derived from confirmatory test and numerical analysis. The maximum deviation between thermal analysis and thermal test are not exceeding 8%. The correctness of numerical simulation and the validity of temperature prediction were verified. In thermal test

the averaged temperature value and maximum temperature gradient value of the apparatus are 17.2~22.5 ℃ and 1.4 ℃

respectively.

关键词

Keywords

references

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