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天津大学 力学系 天津,300072
收稿日期:2011-03-08,
修回日期:2011-04-30,
网络出版日期:2011-09-26,
纸质出版日期:2011-09-26
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郭振山, 王世斌, 李林安, 贾海坤, 门玉涛, 何巍. 纳米尺度金属薄膜在拉伸状态下的稳定性[J]. 光学精密工程, 2011,19(9): 2293-2299
GUO Zhen-shan, WANG Shi-bin, LI Lin-an, JIA Hai-kun, MEN Yu-tao, HE Wei. Stability of nano-scale thin metal films under tension[J]. Editorial Office of Optics and Precision Engineering, 2011,19(9): 2293-2299
郭振山, 王世斌, 李林安, 贾海坤, 门玉涛, 何巍. 纳米尺度金属薄膜在拉伸状态下的稳定性[J]. 光学精密工程, 2011,19(9): 2293-2299 DOI: 10.3788/OPE.20111909.2293.
GUO Zhen-shan, WANG Shi-bin, LI Lin-an, JIA Hai-kun, MEN Yu-tao, HE Wei. Stability of nano-scale thin metal films under tension[J]. Editorial Office of Optics and Precision Engineering, 2011,19(9): 2293-2299 DOI: 10.3788/OPE.20111909.2293.
将薄膜和基底作为一个基本结构来研究薄膜的变形和损坏可预测纳米薄膜器件的使用寿命。本文讨论和研究了薄膜基底结构在拉伸载荷下薄膜出现的分叉和断裂的过程。用在相同厚度的PET基底上沉积不同厚度铝膜的薄膜基底结构作为试件
分别对薄膜厚度为100
150和200 nm的3种不同试件进行了拉伸加载实验
并在OLYMPUS显微镜下观察了薄膜表面的变化情况。分析和对比结果表明:随着薄膜厚度的增加
薄膜出现分叉现象的失效应变也随着增大;当薄膜表面出现裂纹时
裂纹密度的大小取决于薄膜的厚度和加载应变的大小。
This paper presents a basic structure combined with a film and a substrate to investigate the damage and deformation of thin films and to predict the life time of MEMS. The bifurcation and fracture of thin films under a tensive load were determined by an experiment where the film/substrate structure was used as the specimen.The substrate was a deposited aluminium film with different thicknesses of 100
150 and 200 nm. Then the experiment was initiated using our designed loading device. An OLYMPUS microscope was used to observe the change of the topography of the film surface. The destruction of the film and the corresponding sizes of the load and displacement were recorded.Finally
the effects of film thickness on bifurcation and fracture were obtained by comparing experimental results. These show that the relevant rupture strain increases with the film thickness and the crack density along the loading direction depends on the thickness of the film and the failure stain when there are cracks appear on the film surface.
GIOLA G, ORTIZ M. Delamination of compressed thin films [J]. Adv. Appl. Mech., 1997, 33: 120-192.[2] ZHOU Z Y,YE X Y,CUI T H, et al.. Micro-technology/nanotechnology and MEMS [J]. Opt. Precision Eng., 1998,6(2):1-7.[3] HILL R, HUTCHINSON J W. Bifurcation phenomena in the plane tension test [J]. Mech. Phys.Solid, 1975, 23:239-264.[4] DORRIS J F, NEMAT-NASSER. Instability of a layer on a half space [J]. Appl. Mech., 1980, 47:304-312.[5] STEIF P P. Periodic necking instabilities in layered plastic solids [J]. Solids Struct, 1986, 22:195-207.[6] BIGONI D, ORTIZ,M. Needleman. Effect of interfacial compliance on bifurcation of a layer bonded to a substrate [J]. Solids Struct., 1997,34:4305-4326.[7] LI T, HUANG Z Y, LACOUR S P,et al.. Stretch ability of thin metal films on elastomer substrates [J]. Appl. Phys. Lett. 2004,85:3435-3437.[8] KANG Y S. Microstructure and strengthening mechanisms in aluminum thin films on polyimide film. Austin:The University of Texas,1996.[9] PASHLEY D W. A study of the deformation and fracture of single-crystal gold films of high strength inside an electron microscope [J]. Proc.Roy.Soc.Lond.A, 1960, 255:218-231.[10] LEE ZHANG H J, BRAVMAN J C. Tensile failure by grain thinning in micro-machined aluminum thin film [J]. Appl.Phys, 2003,93:1443-1451.[11] CHIU S L, LEU J, HO P S. Fracture of metal-polymer line structures [J]. Appl.Phys, 1994, 76: 5136-5142.[12] MACIONCZYK F,BRUCKNER W. Tensile testing of Al/Cu thin films no polyimide foils [J]. Appl.Phys, 1999, 86:4922-4929.[13] GAGE D M, PHANITSIRI M. Experimental and mathematical analysis of tensile fracture mechanics in thin-film metal deposits. Princeton:Princeton University, 2001.[14] YU D Y W,SPAEPEN F. The yield strength of thin copper films on Kapton [J]. Applied Physics, 2004, 95: 2991-2997. [15] LI TENG,SUO Z. Deformability of thin metal films on elastomer substrates [J]. Solids and Structures, 2006, 43: 2351-2363.[16] XIANG Y, LI T, SUO Z,et al.. High ductility of a metal film adherent on a polymer substrate [J]. Appl. Phys, 2005, 87: 161910.
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