聚晶金刚石复合片的电火花线切割精密加工试验

宋满仓; 张建磊; 于超; 王敏杰; 刘冲

doi:10.3788/OPE.20122006.1303

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聚晶金刚石复合片的电火花线切割精密加工试验

微纳技术与精密机械 | 更新时间：2020-08-12

- 聚晶金刚石复合片的电火花线切割精密加工试验
- Experiment of WEDM precision machining for polycrystalline diamond compact
- 光学精密工程 2012年20卷第6期页码：1303-1309
- 作者机构：
  
  1. 大连理工大学微纳米技术及系统辽宁省重点实验室,辽宁大连,中国,116023
  2. 大连理工大学模塑制品教育部工程研究中心,辽宁大连,116023
  3. 三菱电机大连理工大学电加工技术中心,辽宁大连,116023
- 作者简介：
- 基金信息：
  
  国家自然科学基金重大项目(No.20890024)();国家973重点基础研究发展计划资助项目(No.2007CB714502)()
- DOI：10.3788/OPE.20122006.1303
  中图分类号： TG484
- 收稿日期：2011-12-15，
  
  修回日期：2012-02-10，
  
  网络出版日期：2012-06-10，
  
  纸质出版日期：2012-06-10
- 稿件说明：
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宋满仓, 张建磊, 于超, 王敏杰, 刘冲. 聚晶金刚石复合片的电火花线切割精密加工试验[J]. 光学精密工程, 2012,20(6): 1303-1309

SONG Man-cang, ZHANG Jian-lei, YU Chao, WANG Min-jie, LIU Chong. Experiment of WEDM precision machining for polycrystalline diamond compact[J]. Editorial Office of Optics and Precision Engineering, 2012,20(6): 1303-1309
宋满仓, 张建磊, 于超, 王敏杰, 刘冲. 聚晶金刚石复合片的电火花线切割精密加工试验[J]. 光学精密工程, 2012,20(6): 1303-1309 DOI： 10.3788/OPE.20122006.1303.

SONG Man-cang, ZHANG Jian-lei, YU Chao, WANG Min-jie, LIU Chong. Experiment of WEDM precision machining for polycrystalline diamond compact[J]. Editorial Office of Optics and Precision Engineering, 2012,20(6): 1303-1309 DOI： 10.3788/OPE.20122006.1303.

摘要

为了提高聚晶金刚石(PCD)刀具的生产效率

改进加工表面质量并减少刃磨余量

利用慢走丝电火花线切割机床(WEDM)对PCD复合片进行了加工工艺试验。对PCD复合片进行了5次切割

并分别测量了每次加工后的表面粗糙度、富钴界面层凹槽深度及宽度和PCD层刃口加工质量。试验结果表明:PCD复合片经慢走丝线切割多次加工

能够得到较好的表面质量

在众多影响因素中金刚石颗粒大小对加工质量影响较大;其中CTH025型号和CTB010型号的最终表面粗糙度分别为

=0.85 μm和

=0.57 μm

富钴界面层凹槽的深度分别为16.3 μm和5.7 μm

刃口处切口缺陷的尺寸也与金刚石颗粒的尺寸相当。经WEDM加工后的PCD复合片的刃磨余量可控制在4~15 μm左右。

Abstract

In order to improve the production efficiency

surface quality and reduce the grinding margins of Polycrystalline Diamond (PCD) compact cutting tools

a series of experiments of Low-speed Wire Cutting Electric Discharge Machining (LS-WEDM) for a PCD compact were taken. The PCD compact was cut by the WEDM for five times

then the surface roughness of cutting section

the machining quality of cobalt-rich interface layer and the edge of PCD layer were measured and discussed. The results indicate that the PCD compact shows better surface quality in its cutting section after multiple processing by LS-WEDM

and the machining quality is affected by diamond particle sizes greatly. For two kinds of PCD compacts

CTH025 and CTB010

the surface roughness are

=0.85 μm and

=0.57 μm

and the depths of the grooves of cobalt-rich interface layer are 16.3 μm and 5.7 μm

respectively. The size of the defect in the edge of PCD compact is matched with that of the diamond particle. The minimum grinding margins of PCD cutting tools can be controlled in 4-15 μm after LS-WEDM.

关键词

Keywords

references

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