利用数字全息干涉术测量电路板的连续弯曲形变

杨德兴; 许增奇; 姜宏振; 付永辉; 王骏; 邵兆申; 赵建林

doi:10.3788/OPE.20122008.1789

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利用数字全息干涉术测量电路板的连续弯曲形变

微纳技术与精密机械 | 更新时间：2020-08-12

- 利用数字全息干涉术测量电路板的连续弯曲形变
- Measurement of continuous bending deformation for circuit boards by digital holographic interferometry
- 光学精密工程 2012年20卷第8期页码：1789-1795
- 作者机构：
  
  1. 西北工业大学理学院陕西省光信息技术重点实验室空间应用物理与化学教育部重点实验室,陕西西安,710072
  2. 中国空间技术研究院西安分院,陕西西安 710100
- 作者简介：
- 基金信息：
  
  国家自然科学基金资助项目(No. 61127011)()
- DOI：10.3788/OPE.20122008.1789
  中图分类号： O438.1;TN407
- 收稿日期：2012-03-13，
  
  修回日期：2012-04-27，
  
  纸质出版日期：2012-08-10
- 稿件说明：
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杨德兴, 许增奇, 姜宏振, 付永辉, 王骏, 邵兆申, 赵建林. 利用数字全息干涉术测量电路板的连续弯曲形变[J]. 光学精密工程, 2012,(8): 1789-1795

YANG De-xing, XU Zeng-qi, JIANG Hong-zhen, FU Yong-hui, WANG Jun, SHAO Zhao-shen, ZHAO Jian-lin. Measurement of continuous bending deformation for circuit boards by digital holographic interferometry[J]. Editorial Office of Optics and Precision Engineering, 2012,(8): 1789-1795
杨德兴, 许增奇, 姜宏振, 付永辉, 王骏, 邵兆申, 赵建林. 利用数字全息干涉术测量电路板的连续弯曲形变[J]. 光学精密工程, 2012,(8): 1789-1795 DOI： 10.3788/OPE.20122008.1789.

YANG De-xing, XU Zeng-qi, JIANG Hong-zhen, FU Yong-hui, WANG Jun, SHAO Zhao-shen, ZHAO Jian-lin. Measurement of continuous bending deformation for circuit boards by digital holographic interferometry[J]. Editorial Office of Optics and Precision Engineering, 2012,(8): 1789-1795 DOI： 10.3788/OPE.20122008.1789.

摘要

采用离轴菲涅耳数字全息干涉术实现了对电路板表面的连续弯曲形变测量。在电路板两端依次施加0.01 mm至15 mm位移载荷过程中

记录了1 501幅全息图。通过相邻两幅全息图数值重建的复振幅相位分布相减得到干涉相位差

根据相位差与离面位移的关系计算得到照明测量区域的离面位移

通过累加获得了施加1~15 mm位移载荷时电路板表面的弯曲形变测量结果。由5块相同规格电路板上照明测量区域中同一电容中心点的离面位移

计算得到测量结果的A类不确定度不超过0.008 mm

加载夹具引起的测量结果的B类不确定度为0.003 5 mm

测量结果的合成不确定度不超过0.008 7 mm。实验表明这种利用离轴菲涅耳数字全息干涉术测量物体大位移连续弯曲形变的方法具有良好的重复性和稳定性。

Abstract

The measurement of continuous bending deformation for a circuit board surface was achieved by using digital off-axis Fresnel holographic interferometry. 1 501 holograms were recorded by applying a displacement load to both ends of the circuit board from 0 to 15 mm by the step of 0.01 mm.The interference phase difference was obtained by subtracting the complex amplitude phase distributions of two adjacent holograms with numerical reconstruction. Then

the out-of-plane displacement of the lighting measurement area was obtained according to the relationship between the phase difference and the out-of-plane displacement

and the measurement results were obtained by accumulating the bending deformation of the displacement load from 1 mm to 15 mm. By calculating the out-of-plane displacements of the same capacitor center in the lighting measurement area from five pieces of circuit boards with the same specifications

it indicates that the measurement results are no more than 0.008 mm for the type A uncertainty

no more than 0.003 5 mm for the type B uncertainty from a loading clamp and no more than 0.008 7 mm for the combined uncertainty. The results show that the method based on digital off-axis Fresnel holographic interferometry for measuring the continuous bending deformation of the object with a large displacement load has good repeatability and stability.

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references

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