超声处理对UV-LIGA工艺中SU-8胶溶胀的影响

杜立群; 刘亚萍; 李永辉; 李成斌

doi:10.3788/OPE.20122009.2006

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超声处理对UV-LIGA工艺中SU-8胶溶胀的影响

微纳技术与精密机械 | 更新时间：2020-08-12

- 超声处理对UV-LIGA工艺中SU-8胶溶胀的影响
- Effect of ultrasonic treatment on SU-8 swelling in UV-LIGA technology
- 光学精密工程 2012年20卷第9期页码：2006-2013
- 作者机构：
  
  1. 大连理工大学精密与特种加工教育部重点实验室,辽宁大连,116021
  2. 大连理工大学辽宁省微纳米及系统重点实验室,辽宁大连,116024
- 作者简介：
- 基金信息：
  
  国家自然科学基金资助项目(No.51075057,50675025)()
- DOI：10.3788/OPE.20122009.2006
  中图分类号： TB559;TN305.7
- 收稿日期：2012-03-20，
  
  修回日期：2012-05-15，
  
  纸质出版日期：2012-09-10
- 稿件说明：
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杜立群, 刘亚萍, 李永辉, 李成斌. 超声处理对UV-LIGA工艺中SU-8胶溶胀的影响[J]. 光学精密工程, 2012,20(9): 2006-2013

DU Li-qun, LIU Ya-ping, LI Yong-hui, LI Cheng-bin. Effect of ultrasonic treatment on SU-8 swelling in UV-LIGA technology[J]. Editorial Office of Optics and Precision Engineering, 2012,20(9): 2006-2013
杜立群, 刘亚萍, 李永辉, 李成斌. 超声处理对UV-LIGA工艺中SU-8胶溶胀的影响[J]. 光学精密工程, 2012,20(9): 2006-2013 DOI： 10.3788/OPE.20122009.2006.

DU Li-qun, LIU Ya-ping, LI Yong-hui, LI Cheng-bin. Effect of ultrasonic treatment on SU-8 swelling in UV-LIGA technology[J]. Editorial Office of Optics and Precision Engineering, 2012,20(9): 2006-2013 DOI： 10.3788/OPE.20122009.2006.

摘要

首次将超声处理引入UV-LIGA工艺中

研究了超声处理对SU-8胶模溶胀的影响

并探讨了其影响机理

从而获得了减小胶模溶胀及提高电铸微器件尺寸精度的方法。试验研究了超声处理对显影过程及电铸过程中SU-8胶模溶胀的影响

分析了不同超声时间下SU-8胶表面亲水性的变化趋势

并计算了不同超声时间下胶模的溶胀去除率。讨论了超声处理对不同结构微器件尺寸精度的影响。试验结果表明:SU-8胶模在显影过程中的溶胀不明显

并且超声处理对显影过程中胶模的溶胀影响很小

其主要影响SU-8胶模在电铸过程中的溶胀。随着超声时间的增加

胶模溶胀及其表面亲水性均呈现先减小后增大的趋势。当超声时间为10 min时

胶模溶胀最小

其溶胀去除率值可高达70%

并且超声处理后电铸微器件的尺寸误差与结构尺寸无关。根据超声波的机械断键作用与聚合物吸水机理

从亲水性和内应力两个方面

探究了SU-8胶模溶胀随超声时间的增加而变化的原因。文中提出的减小SU-8胶溶胀的方法不依赖于工艺参数也不会增加掩模图形设计的复杂性

是一种实用的减小SU-8胶溶胀的新方法。

Abstract

Ultrasonic treatment was originally introduced into UV-LIGA technology in this paper. The effect of ultrasonic treatment on SU-8 swelling was researched

and ultrasonic mechanism of SU-8 swelling was explored. Then

a novel method to reduce SU-8 swelling and improve the dimensional precision of an electroformed microstructure was obtained. In experiments

the effect of ultrasonic treatment on the SU-8 swelling during the development and electroforming process was respectively studied

the surface hydrophilicity of SU-8 photoresist in different ultrasonic time was analyzed

and the SU-8 swelling removal ratio in different ultrasonic time was calculated. Furthermore

the effect of ultrasonic treatment on the dimensional precisions of different micro devices was discussed. The experimental results indicate that the SU-8 mould swelling in development process is not obvious

and the ultrasonic treatment has a little effect on the SU-8 mould swelling during development process. The effect of ultrasonic treatment on the SU-8 mould swelling mainly occurs in the electroforming process

and the SU-8 swelling and its surface hydrophilicity both decrease first and increase afterwards with increasing the ultrasonic time. By 10 min ultrasonic treatment

the SU-8 swelling removal ratio is up to 70%

and the dimensional error of electroformed microstructure is independent on the structure of SU-8 mould. Moreover

the reason that SU-8 swelling behavior varies with increasing ultrasonic time was explained based on the ultrasonic mechanical scission of polymer chain and water absorbing mechanism. In conclusion

the presented method to reduce the swelling of SU-8 resist mould does not depend on the process parameters and not increase the complexities of mask layouts

and is a practical method.

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Keywords

references

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