用于微胶接的pL级点胶方法

史亚莉; 李福东; 杨鑫; 张正涛; 徐德

doi:10.3788/OPE.20122012.2744

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用于微胶接的pL级点胶方法

微纳技术与精密机械 | 更新时间：2020-08-13

- 用于微胶接的pL级点胶方法
- pL class adhesive dispensing approach for micro bonding
- 光学精密工程 2012年20卷第12期页码：2744-2750
- 作者机构：
  
  中国科学院自动化研究所精密感知与控制研究中心北京,100190
- 作者简介：
- 基金信息：
  
  国家重大科研仪器设备研制专项资助项目(No.CZBZDYZ20140002)
- DOI：10.3788/OPE.20122012.2744
  中图分类号： TH706;TL632
- 收稿日期：2012-07-26，
  
  修回日期：2012-09-05，
  
  纸质出版日期：2012-12-10
- 稿件说明：
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史亚莉, 李福东, 杨鑫, 张正涛, 徐德. 用于微胶接的pL级点胶方法[J]. 光学精密工程, 2012,20(12): 2744-2750

SHI Ya-li, LI Fu-dong, YANG Xin, ZHANG Zheng-tao, XU De. pL class adhesive dispensing approach for micro bonding[J]. Editorial Office of Optics and Precision Engineering, 2012,20(12): 2744-2750
史亚莉, 李福东, 杨鑫, 张正涛, 徐德. 用于微胶接的pL级点胶方法[J]. 光学精密工程, 2012,20(12): 2744-2750 DOI： 10.3788/OPE.20122012.2744.

SHI Ya-li, LI Fu-dong, YANG Xin, ZHANG Zheng-tao, XU De. pL class adhesive dispensing approach for micro bonding[J]. Editorial Office of Optics and Precision Engineering, 2012,20(12): 2744-2750 DOI： 10.3788/OPE.20122012.2744.

摘要

为了获得与微米级零件尺寸相匹配的pL级胶滴

分析了注射式、喷射式和转移式3种常用的微小液滴生成机制。基于注射式原理设计了一种时间压力型pL级点胶方案

通过视觉在线检测胶斑直径

控制点胶针尖内径、作用压力和时间

得到pL级胶斑。实验研究了针尖内径、压力、时间对胶斑直径的影响

并将此方法应用于激光惯性约束核聚变实验中冷冻靶装配时靶丸零件与充气管零件之间的微胶接。实验结果表明:胶斑直径与点胶针尖内径、压力和时间三者成正比例关系

当使用端部1.2 m内径的点胶针

设置压力为0 psi(1 psi6.895 kPa)

时间为8～10 s时

可以满足胶斑体积小于3 pL

直径小于40 m的指标要求。该方法可实现微米级零件微胶接时的pL级点胶

而且工艺简单

易于实现。

Abstract

To obtain pL class adhesive drop to match the micro parts in size

three kinds of micro drop making mechanisms

injection

bubble jetting

and needle transfer

were analyzed. A pL class adhesive dispensing approach based on time-pressure dispensing was present

then pL class adhesive spots were obtained by online visual monitoring of the spot diameter

and controlling the internal diameter of the dispensing needle tip

pressure and time. The effects of three factors mentioned above on the adhesive spot size were experimented

and this technique combined with a micromanipulation system were used in Inertial Confinement Fosion(ICF) experiments to bond a fill tube and a capsule together for the cryogenic targets. The results show that the adhesive spot diameter is proportional to the internal diameter of the dispensing needle tip

pressure and time. When the internal diameter of needle tip

pressure and time are controlled to be 1.2 m

0 psi

and 8～10 s

the adhesive volume and diameter will be less than 3pL and 40 m

respectively.

关键词

Keywords

references

BRUSSEL H V, PEIRS J, REYNAERTS D, et al.. Assembly of microsystems [J]. Annals of the CLRP, 2000,49(2):451-472.[2] WANG X J, WANG X D, YAO G J, et al.. Automatic micro-bonding technology of capillaries with adhesives.6th International Conference on Electronic Packaging Technology, 2005,1-5.[3] 徐征,王晓东,程新宇,等. 基于机器视觉的微装配控制策略及软件架构[J]. 光学精密工程,2009,17(4):820-824. XU ZH, WANG X D, CHENG X Y, et al.. Control tactics and software architectures for micro-assembly based on machine vision [J]. Opt. Precision Eng., 2009, 17(4): 820-824. (in Chinese)[4] YUSOF A, ZENGERLE R, KOLTAY P. Towards a microfluidic dispenser chip for printing single cells. 24th International Conference on MEMS,2011, MEXICO:Cancun,2011(23-27):1059-1062.[5] SCHUHMACHER D, NIEKRAWIETZ R, SCHEITHAUER H, et al.. Production of solder microdroplets using a highly parallel and contact-free printing method.IEEE 20th International Conference on MEMS,Japan: Kobe,2007,Jan,21-25:357-360.[6] 马维民,HESSELBACN J,郇极. 一种微型步进电机的微胶接装配方法的研究[J]. 中国机械工程,2007,18(9):1024-1027. MA W M, HESSELBACH J, HUAN J. Experimental study on assembling a micro step motor using adhesive bonding technology [J]. China Mechanical Engineering, 2007,18(9):1024-1027. (in Chinese)[7] WANG L D, MILLS J K, WILLIAM L. Adhesive mechanical fastener design for use in microassembly. Electrical and Computer Engineering, 2008:1093-1096.[8] TANIKAWA T, HASHIMOTO Y,ARAI T. Micro drops for adhesive bonding of micro assemblies and making a 3-D structure "micro scarecrow". Proceedings of the 1998 EEE/RSJ Intl. Conference on Intelligent Robots and Systems Victoria, 1998:776-781.[9] WANG L D, MILLS J K,CLEGHORN W L. Robotic manipulation of adhesive droplets for applications in microassembly. Proceedings of the 2009 IEEE International Conference on Information and Automation, 2009:1562-1567.[10] 史亚莉,张文生,徐德,等. 时间/压力型pL级微点胶技术[J]. 光学精密工程,2011,19(11):2724-2730. SHI Y L, ZHANG W SH, XU D, et al.. Time/pressure pL micro-bonding technology [J]. Opt. Precision Eng., 2011, 19(11):2724-2730. (in Chinese)

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