OKIHARU K, TOSHIYUKI E. Ultra-flat and ultra-smooth Cu surfaces produced by abrasive-free chemical-mechanical planarization/polishing using vacuum ultraviolet light[J]. Precision Engineering, 2011,35：669-676.[2]MAKOTO S, TETSUYA K,TORU N. Copper polishing with a polishing pad incorporating abrasive grains and a chelating resin [J]. Precision Engineering, 2009，33：167-174.[3]PANDIJA S,ROY D,BABU S V. Chemical mechanical planarization of copper using abrasive-free solutions of oxalic acid and hydrogen peroxide [J]. Materials Chemistry and Physics,2007,102:144-151.[4]王碧玲，高航，滕晓辑，等.抛光加工参数对KDP晶体材料去除和表面质量的影响[J].人工晶体学报.2010，39(1)：29-43. WANG B L,GAO H, TENG X J, et al.. Effect of polishing parameter on material removal and surface quality of KDP crystal[J]. Journal of Synthetic Crystals, 2010,39 (1):29-43.(in Chinese)[5]ARUN S, NORM G, MICHAEL V, et al.. In-stiu tribological properties monitoring and chemical mechanical characterization of planarization process[C]. Proceedings of 2004 ASME/STLE international joint tribology conference,2004.[6]SIKDER A K, ASHOK K. Mechanical and tribological properties of interlayer films for the Damascene-Cu chemical-mechanical planarization process [J]. Journal of Electronic Materials. 2002, 31(10):1016-1021. [7]LEE J T,WOO J K,LEE E S. A study on the characteristics of a wafer-polishing process according to machining conditions [J].International Journal of Precision Engineering and Manufacturing, 2009,10(1):23-28.[8]徐驰. 基于摩擦力在线测量的化学机械抛光终点检测技术研究[D].大连：大连理工大学，2011.　　XU CH. Study on Chemical Mechanical Polishing Endpoint Detection Technology Based on Friction Force Online Measurement[D].Dalian: Dalian University of Technology,2011. (in Chinese)[9]刘玉岭，李薇薇，周建伟. 微电子化学技术基础[M].北京：化学工业出版社,2005.　　LIU Y L, LI W W, ZHOU J W. Micron Electric Chemical Technology basis[M]. Beijing: Chemical Industry Press ,2005. (in Chinese)[10]罗虹，刘家浚，朱宝亮. 低硬度薄膜厚度的简易检测方法[J].理化检测-物理分册,1994,30(5):49-50. LUO H, LIU J J, ZHU B L. A simple detection method of testing the thickness of low hardness film [J]. Physical Testing and Chemical Analysis Parta Physical Testing: Physical Testing ,1994,30(5):49-50.（in Chinese）[11]王承遇，陶瑛. 玻璃表面处理技术[M].北京：化学工业出版社，2004. WANG C Y, TAO Y. Technology of glass surface treatment [M].Beijing: Chemical Industry Press, 2004. (in Chinese)