浏览全部资源
扫码关注微信
南京理工大学 MEMS惯性技术研究中心,江苏 南京,210094
收稿日期:2012-12-24,
修回日期:2013-02-25,
网络出版日期:2013-07-15,
纸质出版日期:2013-07-15
移动端阅览
赵阳 裘安萍 施芹 赵健. 微机械陀螺检测接口建模及前置放大器优化[J]. 光学精密工程, 2013,21(7): 1734-1740
. Modeling of sensing interface for micromachined gyroscope and its front-end optimization[J]. Editorial Office of Optics and Precision Engineering, 2013,21(7): 1734-1740
赵阳 裘安萍 施芹 赵健. 微机械陀螺检测接口建模及前置放大器优化[J]. 光学精密工程, 2013,21(7): 1734-1740 DOI: 10.3788/OPE.20132107.1734.
. Modeling of sensing interface for micromachined gyroscope and its front-end optimization[J]. Editorial Office of Optics and Precision Engineering, 2013,21(7): 1734-1740 DOI: 10.3788/OPE.20132107.1734.
为了进一步提高微机械陀螺的极限分辨率,建立了基于SOI工艺的微机械陀螺的检测接口模型,并设计了与之相匹配的前置接口放大器。首先,根据陀螺表头的实际结构建立了微机械陀螺表头的RC集总参数模型和微机械陀螺检测接口的噪声模型,分析了检测接口主导噪声源及提高极限分辨率的措施。然后,在跨阻式前置放大器的基础上设计了改进的与检测接口匹配的T型前置放大器。实验结果表明:相比于跨阻式前置放大器,采用改进的T型前置放大器的等效噪声输入电流由1.18 pA/Hz降低至0.27 pA/Hz,对应的电容极限分辨率可达到0.62 aF/Hz。结果显示,采用与检测接口匹配的T型前置放大器提高了微机械陀螺的极限分辨率。
To improve the resolving limit of a micromachined gyroscope
a sensing interface model for the micromachined gyroscope fabricated by Silicon on Insulator(SOI) process was established
and a matching front-end was designed. Firstly
a RC lumped parameter model for the gyroscope was established based on the practical gyroscope structure
then a noise model for the sensing interface was built. The dominant noise source and methods to improve the resolving limit were analyzed. Finally
on the foundation of a TIA front-end
an improved T-network front-end was designed to match the sensing interface. Experimental results indicate that the T-network front-end improves the sensing interface equivalent input noise current from 1.18 pA/Hz to 0.27 pA/Hz
corresponding to a capacitive resolution of 0.62 aF/Hz as compared to those of the transimpedance front-end. It suggests that the improved T-network front-end can reach a better resolution.
刘危,解旭辉,李圣怡.微机械惯性传感器的技术现状及展望[J]. 光学 精密工程,2003,11(5): 425-431. LIU W, XIE X H, LI SH Y. Present state and perspectives of micromachined inertial sensors [J]. Opt. Precision Eng., 2003, 11(5): 425-431. (in Chinese)[2]BARBOUR N, SCHMIDT G. Inertial sensor technology trends [J]. IEEE Sensors Journal, 2001, 1(4):332-339.[3]YAZDI N, AYAZI F, NAJAFI K. Micromachined inertial sensors [J]. Proceedings of the IEEE,1998, 86(8): 1640-1659.[4]JASON K P H. Modeling and Identification of the Jet Propulsion Laboratory Vibratory Rate Microgyroscope [D]. Los Angeles: Mechanical engineering, University of California, 2002.[5]CHOI B D, PARK S, KO H, et al.. The first sub-deg/hr bias stability silicon-microfabricated Gyroscope [C]. Solid-State Sensors, Actuators and Microsystems , Transducers, 2005: 180-183.[6]JIANG X S. Capacitive Position-sensing Interface for Micromachined Inertial Sensors [D]. California: University of California, Berkeley, 2003.[7]ACAR C. Robust Micromachined Vibratory Gyroscopes [D]. California:Irvine University of California, 2004.[8]李锦明. 电容式微机械陀螺仪设计 [M]. 北京:国防工业出版社,2006.LI J M. Design of Capacitive Micromechanical Gyroscope [M]. Beijing: National Defense Industrial Press, 2006. (in Chinese)[9]GABRIELSON T B. Mechanical-thermal noise in micromachined acoustic and vibration sensors [J]. IEEE Trans on Electron Devices, 1993, 40 (5): 903-909. [10]刘梅,周百令. 硅微陀螺机械热噪声研究 [J]. 仪器仪表学报,2006,27(S2):1163-1164.LIU M, ZHOU B L. Research on mechanical-thermal noise in micromachined gyroscopes [J]. Chinese Journal of Scientific Instrument, 2006, 27(S2): 1163-1164. (in Chinese)[11]FRANCO S. Design with Operational Amplifiers and Analog Integrated Circuits [M]. New York: McGraw Hill, 2002.[12]RICHARD C D. Modern Control Systems [M]. Pearson Education, 2008.[13]GRAEME J. Photodiode Amplifiers: OP Amp Solutions [M]. New York: McGraw Hill, 1996.[14]SHARMA A, ZAMAN M F, AYAZI F. A 104 db SNDR Transimpedance-Based CMOS ASIC Fortuning Fork Micro Gyroscopes [C]. IEEE Custom Integrated Circuits Conference, 2006: 655-658.
0
浏览量
77
下载量
4
CSCD
关联资源
相关文章
相关作者
相关机构