逐层微细电阻滑焊工艺制备三维微结构

徐斌; 伍晓宇; 雷建国; 罗烽; 龚峰; 杜晨林; 阮双琛; 王振龙

doi:10.3788/OPE.20142205.1251

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逐层微细电阻滑焊工艺制备三维微结构

微纳技术与精密机械 | 更新时间：2020-08-13

- 逐层微细电阻滑焊工艺制备三维微结构
- Fabrication of 3D microstructure with layer-by-layer micro-electric resistance slip welding
- 光学精密工程 2014年22卷第5期页码：1251-1259
- 作者机构：
  
  1. 深圳大学机电与控制工程学院深圳市模具先进制造技术重点实验室,广东深圳,518060
  2. 深圳大学电子科学与技术学院深圳市激光工程重点实验室,广东深圳,518060
  3. 哈尔滨工业大学机电工程学院微系统与微结构制造教育部重点实验室,黑龙江哈尔滨,150001
- 作者简介：
- 基金信息：
  
  国家自然科学基金资助项目（No.51175348，51375315）();广东省教育厅重点实验室开放基金资助项目（No.201002）()
- DOI：10.3788/OPE.20142205.1251
  中图分类号： TG485;TG661
- 收稿日期：2013-12-09，
  
  修回日期：2014-01-20，
  
  纸质出版日期：2014-05-25
- 稿件说明：
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徐斌, 伍晓宇, 雷建国等. 逐层微细电阻滑焊工艺制备三维微结构[J]. 光学精密工程, 2014,22(5): 1251-1259

XU Bin, WU Xiao-yu, LEI Jian-guo etc. Fabrication of 3D microstructure with layer-by-layer micro-electric resistance slip welding[J]. Editorial Office of Optics and Precision Engineering, 2014,22(5): 1251-1259
徐斌, 伍晓宇, 雷建国等. 逐层微细电阻滑焊工艺制备三维微结构[J]. 光学精密工程, 2014,22(5): 1251-1259 DOI： 10.3788/OPE.20142205.1251.

XU Bin, WU Xiao-yu, LEI Jian-guo etc. Fabrication of 3D microstructure with layer-by-layer micro-electric resistance slip welding[J]. Editorial Office of Optics and Precision Engineering, 2014,22(5): 1251-1259 DOI： 10.3788/OPE.20142205.1251.

摘要

采用飞秒激光切割和微细电阻滑焊组合的方法制备了高深宽比的三维微结构。为了提高每层二维微结构的叠加精度和连接强度，用逐层微细电阻滑焊对每层二维微结构进行滑焊以获得较好的工艺参数。对上述工艺参数所制备的微结构进行了抗剪切能力测试，测试结果显示：随着滑焊放电次数的增加，微结构的极限剪切力由8.04N逐渐增加至65.97N。而后，通过能量分散光谱仪（EDS）对电极的沉积效应进行了研究。最后，在120mW的飞秒激光，50μm/s的切割速度，0.21V的焊接电压，0.2MPa的焊接压强，100ms的预压时间，10ms的焊接时间以及160次的滑焊放电次数等工艺参数下制备了基本尺寸为50μm×50μm的微方孔阵列以及微齿轮结构。实验结果表明：通过逐层微细电阻滑焊制备的微结构表面质量良好，各层微结构之间叠加较好，显示逐层微细电阻滑焊可以较好地保证三维微结构中各层二维微结构的连接强度和叠层精度。

Abstract

A 3D microstructure with a high depth-to-width ratio was fabricated by combining femtosecond laser cutting and micro-electric resistance slip welding. To improve laminated precision and connection strength of every layer 2D microstructure

the layer-by-layer micro-electric resistance slip welding was used for every layer 2D microstructure to obtain a better technological parameters. Under above process parameters

the anti-shear ability of 3D microstructure was tested. The test results indicate that with the number of the slip welding discharges increasing

the yield shear stress of microstructure increases from 8.04 N to 65.97 N.Then

the deposition effect of the tungsten bar electrode produced during layer-by-layer micro-electric resistance slip welding was also studied through the Energy Dispersive Spectrometer(EDS)analysis.Finally

micro array square holes with a size of 50 μm×50 μm and a micro-gear cavity were processed after 160 time's slip welding discharge under a femtosecond laser power of 110 mW

a cutting speed of 50 μm/s

a welding voltage of 0.21 V

welding time of 10 ms

and a welding pressure of 0.2 MPa.The fabrication results show that the 3D microstructures processed by the layer-by-layer micro-electric resistance slip welding have good surface quality and the superposition between the layers of microstructure.Therefore

layer-by-layer micro-electric resistance slip welding can guarantee the connection strength and laminated precision of every layer 2D microstructure.

关键词

Keywords

references

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