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1. 大连理工大学 精密与特种加工教育部重点实验室,辽宁 大连,116023
2. 大连理工大学 辽宁省微纳米及系统重点实验室,辽宁 大连,116024
收稿日期:2014-07-03,
修回日期:2014-08-25,
纸质出版日期:2015-03-25
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杜立群, 鲍其雷, 赵明等. 在金属基底上制作高深宽比金属微光栅的方法[J]. 光学精密工程, 2015,23(3): 700-707
DU Li-qun, BAO Qi-lei, ZHAO Ming etc. Fabrication of metal micro-grating with high aspect ratio on metal substrate[J]. Editorial Office of Optics and Precision Engineering, 2015,23(3): 700-707
杜立群, 鲍其雷, 赵明等. 在金属基底上制作高深宽比金属微光栅的方法[J]. 光学精密工程, 2015,23(3): 700-707 DOI: 10.3788/OPE.20152303.0700.
DU Li-qun, BAO Qi-lei, ZHAO Ming etc. Fabrication of metal micro-grating with high aspect ratio on metal substrate[J]. Editorial Office of Optics and Precision Engineering, 2015,23(3): 700-707 DOI: 10.3788/OPE.20152303.0700.
根据光学领域对高深宽比金属微器件的需求
利用UV-LIGA工艺在金属基底上制作了具有高深宽比的金属微光栅。采用分层曝光、一次显影的方法制作了微电铸用SU-8胶厚胶胶模
解决了高深宽比厚胶胶模制作困难的问题。由于电铸时间长易导致铸层缺陷
故采取分次电铸等措施得到了电铸光栅结构;同时通过线宽补偿的方法解决了溶胀引起的线宽变小问题。在去胶工序中
采用"超声-浸泡-超声"循环往复的方法。最终
制作了周期为130 μm、凸台长宽高为900 μm× 65 μm×243 μm的金属微光栅
其深宽比达到5
尺寸相对误差小于1%
表面粗糙度小于6.17 nm。本文提出的工艺方法克服了现有方法制作金属微光栅时高度有限、基底易碎等局限性
为在金属基底上制作高深宽比金属微光栅提供了一种可行的工艺参考方案。
According to the requirements of optical fields for metal micro devices with higher aspect ratios
a metal micro-grating with the high aspect ratio was fabricated on a metal substrate by using the UV-LIGA technology. The “exposure step by step” and “development once” were used to fabricate a SU-8 thick photoresist mold with high aspect ratio to overcome the technologic difficulty in fabrication processing. For the defects of electroforming layer caused by long operation time
the fractional electroforming and other methods were adopted to obtain the electroforming grating structure.. At the same time
the line width compensation method was taken to solve the problem that line width of SU-8 photoresist mold was reduced by swelling. In the process of stripping photoresist after electroforming
the ultrasonic method and soaked method were alternately used. Finally
the metal micro-grating with a period of 130 μm
and a size of 900 μm×65 μm×243 μm was fabricated. The high aspect ratio of the metal micro-grating reaches 5
and its relative error on overall dimensions is lower than 1%. Moreover
the surface roughness of metal micro-grating is lower than 6.17 nm. This research breaks the height limitation and substrate fragile of the exciting fabrication methods for metal micro-gratings with high aspect ratios.
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杜立群, 李成斌, 李永辉, 等. 超声时效技术在微注塑模具制作中的应用 [J]. 光学 精密工程, 2012, 20(6):1250-1256. DU L Q, LI CH B, LI Y H, et al.. Application of ultrasonic stress relief technology to microinjection mold fabrication [J]. Opt. Precision Eng., 2012, 20(6):1250-1256. (in Chinese)
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杜立群, 朱神渺, 刘冲. UV-LIGA 工艺中SU-8光刻胶的热溶胀性研究 [J]. 压电与声光, 2008, 30(5):621-623. DU L Q, ZHU SH M, LIU CH. Study on the thermal swelling of SU-8 photoresist in UV-LIGA technique [J]. Piezoelectrics and Acoustooptics, 2008, 30(5):621-623. (in Chinese)
杜立群, 刘亚萍, 李永辉, 等. 超声处理对UV-LIGA工艺中SU-8胶溶胀的影响 [J]. 光学 精密工程, 2012, 20(9):2006-2013. DU L Q, LIU Y P, LI Y H, et al.. Effect of ultrasonic treatment on SU-8 swelling in UV-LIGA technology [J]. Opt. Precision Eng., 2012, 20(9):2006-2013. (in Chinese)
杜立群, 朱神渺, 喻立川. 后烘温度对SU-8光刻胶热溶胀性及内应力的影响 [J]. 光学 精密工程, 2008, 16(3):500-504. DU L Q, ZHU SH M, YU L CH. Effect of post exposure bake temperature on thermal swelling of SU-8 photoresist [J]. Opt. Precision Eng., 2008, 16(3):500-504. (in Chinese)
LEE M C, PEPPAS N A. Models of moisture transport and moisture-induced stresses in epoxy composites [J]. Journal of Composite Materials, 1993, 27(12):1146-1171.
Du L Q, Li Y H, Liu J F. Influence of current density on the interfacial bond strength of electroformed layers [J]. Micro and Nano Letters, 2012, 7(5):402-406.
SHAO L G, DU L Q, WANG L D. Electrochemical activation of substrate surfaces in micro-electroforming [J]. Micro and Nano Letters, 2013, 8(12):872-876.
肖日松, 杜立群, 刘海军, 等. 微电铸的析氢现象研究 [J]. 中国机械工程, 2005(z1):446-448. XIAO R S, DU L Q, LIU H J, et al.. Research on phenomenon of hydrogen evolution in micro-electroforming [J]. Chinese Journal of Mechanical Engineering, 2005 (z1):446-448. (in Chinese)
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