PC微流控芯片黏接筋与溶剂的协同辅助键合

范建华; 邓永波; 宣明; 刘永顺; 武俊峰; 吴一辉

doi:10.3788/OPE.20152303.0708

您当前的位置：

首页 >

文章列表页 >

PC微流控芯片黏接筋与溶剂的协同辅助键合

微纳技术与精密机械 | 更新时间：2020-08-13

- PC微流控芯片黏接筋与溶剂的协同辅助键合
- Synergistic bonding process of solvent and tendon for PC-based microfluidic chips
- 光学精密工程 2015年23卷第3期页码：708-713
- 作者机构：
  
  1. 中国科学院长春光学精密机械与物理研究所,吉林长春,中国,130033
  2. 中国科学院大学北京,中国,100049
- 作者简介：
- 基金信息：
  
  国家863高技术研究发展计划资助项目(No.2012AA040503)();国家自然科学基金资助项目(No.5120538)()
- DOI：10.3788/OPE.20152303.0708
  中图分类号： TN405;TQ320.66
- 收稿日期：2014-01-10，
  
  修回日期：2014-02-15，
  
  纸质出版日期：2015-03-25
- 稿件说明：
移动端阅览
范建华, 邓永波, 宣明等. PC微流控芯片黏接筋与溶剂的协同辅助键合[J]. 光学精密工程, 2015,23(3): 708-713

FAN Jian-hua, DENG Yong-bo, XUAN Ming etc. Synergistic bonding process of solvent and tendon for PC-based microfluidic chips[J]. Editorial Office of Optics and Precision Engineering, 2015,23(3): 708-713
范建华, 邓永波, 宣明等. PC微流控芯片黏接筋与溶剂的协同辅助键合[J]. 光学精密工程, 2015,23(3): 708-713 DOI： 10.3788/OPE.20152303.0708.

FAN Jian-hua, DENG Yong-bo, XUAN Ming etc. Synergistic bonding process of solvent and tendon for PC-based microfluidic chips[J]. Editorial Office of Optics and Precision Engineering, 2015,23(3): 708-713 DOI： 10.3788/OPE.20152303.0708.

摘要

为了在微流控芯片上形成封闭的微通道等功能单元

克服热压键合中微流控结构的塌陷和热压所致芯片微翘曲对后续键合的影响

提出了一种适用于硬质聚合物微流控芯片的黏接筋与溶剂协同辅助的键合方法。以聚碳酸酯(PC)微流控芯片为研究对象

通过热压法在PC微流控芯片上的微通道两侧制作凸起的黏接筋

通过化学溶剂丙酮微溶PC圆片的表面

然后将PC圆片与带有黏接筋的PC微流控芯片贴合、加压、加热

从而实现微流控芯片的键合。分析了键合机理

并对键合工艺参数进行了优化。实验结果表明:键合质量受丙酮溶剂溶解PC圆片的时间和键合温度的影响

能够保证键合质量的最佳键合温度为80~90°

溶解时间为35~45 s

芯片的键合总耗时为3 min。与已有键合工艺相比

所提出的黏接筋与溶剂辅助键合工艺有效提高了键合效率。该键合方法不仅适用于具有不同宽度尺寸微通道的微流控芯片

还可扩展用于不同材料的硬质聚合物微流控芯片。

Abstract

To form enclosed microchannels in microfluidic chips

a bonding method suitable for a polymer microfluidic chip was proposed to overcome the microstructure collapse of hot bonding and the microwarp of microfluidic chip fabricated by hot embossing and to ensure the subsequent bonding. A PC microfluidic chip was used in the research. The heating pressure method was used to prepare bonding tendons in two sides on microchannels of the microfluidic chip and the chemical solvent acetone was used to dissolve the surface of PC wafer slightly. Then the PC wafer and the microfluidic chip with bonding tendons were fitted

pressured and heated

and the bonding process was implemented. The bonding mechanism was analyzed and the bonding process parameters were also optimized. Experimental results illustrate that dissolving time and bonding temperature influence the bonding quality obviously. The microfluidic chip with acceptable quality is achieved when the bonding temperature is between 80° and 90℃ and the dissolving time is between 35 s and 45 s. Entire bonding process just needs 3 minutes. As compared with traditional process

this bonding process has improved the processing efficiency greatly and it not only can be used for the microfluidic chip with different channel widths

but also is suitable for the microfluidic chips fabricated by other polymers.

关键词

Keywords

references

林秉承, 秦建华. 图解微流控芯片实验室 [M]. 北京:科学出版社, 2008. LIN B CH, QIN J H. Graphic Laboratory on a Microfluidic Chip [M]. Beijing:Science Press, 2008. (in Chinese)

孟伟东, 孙丽存, 李强, 等. 基于PDMS基片的可变焦柱透镜 [J]. 中国光学, 2013, 6(3):365-370. MENG W D, LIN L C, LI Q et al.. Variable-focus cylindrical lens based on a PDMS substrate [J]. Chinese Optics, 2013, 6(3):365-370. (in Chinese)

李明宇, 薛懿, 罗根, 等. 平面光波导生物传感器微流通道的不可逆封合 [J]. 中国光学, 2013, 6(1):103-110. LING M Y, XUE Y, LUO G, et al.. Irreversible adherence of micro-fluidic channel of bio-sensor on slab optical waveguide [J]. Chinese Optics, 2013, 6(1):0103-0110. (in Chinese)

LEE B S, LEE Y U, KIM H S, et al.. Fully integrated lab-on-a-disc for simultaneous analysis of biochemistry and immunoassay from whole blood [J]. Lab on a Chip, 2011, 11(1):70-78.

BURGER R, KIRBY D, GLYNN M, et al.. Centrifugal microfluidics for cell analysis [J]. Chemical Biology, 2012, 16:409-414.

STROHMEIER O, EMPERLE A, ROTH G, et al.. Centrifugal gas-phase transition magnetophoresis(GTM)-a generic method for automation of magnetic bead based assays on the centrifugal microfluidic platform and application to DNA purification [J] Lab on a Chip, 2013, 13:146-155.

邓永波, 张平, 杜新, 等. 亲/ 疏水性不同壁面组成微通道的深宽比与通道内液体的自发毛细流动 [J]. 光学精密工程, 2010, 18(7):1562-1567. DENG Y B, ZHANG P, DU X, et al.. Aspect ratio for microchannels with nonuniform surface properties and spontaneous capillary [J]. Opt. Precision Eng. , 2010, 18(7):1562-1567. (in Chinese)

罗怡, 张苗苗, 孙屹博, 等. 面向聚合物微器件超声波精密封接的阵列波导能结构 [J]. 光学精密工程, 2011, 19(4):754-761. LUO Y, ZHANG M M, SUN Q B, et al.. Microenergy director array for ultrasonic precise sealing of polymer MEMS device [J]. Opt. Precision Eng. , 2011, 19(4):754-761. (in Chinese)

徐征, 王继章, 杨铎, 等. 辅助溶剂对PMMA微流控芯片模内键合的影响 [J]. 光学精密工程, 2012, 20(2):321-328. XU ZH, WANG J ZH, YANG Y, et al.. Effect of assistant solvent on in-mold bonding of PMMA microfluidic chips [J]. Opt. Precision Eng., 2012, 20(2):321-328. (in Chinese)

WANG X D, JIN J, LI X, et al.. Low-pressure thermal bonding [J]. Microelectronic Engineering, 2011, 88:2427-2430.

CHO W W Y, LEI K, SHI G, et al.. Microfluidic channel fabrication by PDMS-interface bonding [J]. Smart Materials and Structures, 2006, 15:S112-S116.

张宗波. 聚合物微流控芯片超声波键合机理与方法研究. 大连:大连理工大学博士论文, 2010. ZHANG Z B. Study on the Mechanism and Methods of Ultrasonic Bonding for Polymer Microfluidic Chips. Dalian:Dalian University of Technology, 2010. (in Chinese)

KOESDJOIO M T, TENNICO Y H, REMCHO V T. Fabrication of a microfluidic system for capillary electrophoresis using a two-stage embossing technique and solvent welding on poly(methylmethacrylate) with water as a sacrificial layer [J]. Anal. Chem, 2008, 80(7):2311-2318.

UMBRECHT F, MLLER D, GATTIKER F, et al.. Solvent assisted bonding of polymethylmethacrylate:Characterization using the response surface methodology [J]. Sensors and Actuators A:Physical, 2009, 156:121-128.

严志云, 石虹桥, 梁世强, 等. 聚合物复合材料界面粘合理论研究进展 [J]. 仲恺农业技术学院学报, 2007, 20(2):62-65. YAN ZH Y, SHI H Q, LIANG SH Q, et al.. Progressof study on the interfacial adhesion of polymer composites [J]. Journal of Zhong kai University of Agriculture andTechnology, 2007, 20(2):62-65. (in Chinese)

NG S H, TJEUNG R T, WANG Z F, et al.. Thermally activated solvent bonding of polymer [J]. Microsyst Technol. , 2008, 14:753-759.

高保娇. 溶解度参数及其应用 [J]. 山西化工, 1998(2):18-19. GAO B Q. Application for solubility parameters [J]. Shanxi Chemical Industry, 1998(2):18-19. (in Chinese)

TSAO C W, DEVOE D L. Bonding of thermoplastic polymer microfluidics [J]. Microfluid Nanofluid, 2009, 6:1-16.

浏览量

328

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

微流控芯片操作机器人碰撞保护装置的设计

集成纳米增强基底的微流控SERS芯片及其致病菌检测

微流道精密磨削技术及自驱动检测芯片实验研究

微流控细胞芯片LED诱导透射式荧光检测微系统

具有三维聚焦功能的微流控芯片