大口径SiC离轴非球面的高效磨削加工

殷龙海; 王孝坤; 李龙响; 李丽富; 张志宇; 郑立功; 张学军

doi:10.3788/OPE.20152309.2497

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大口径SiC离轴非球面的高效磨削加工

现代应用光学 | 更新时间：2020-08-12

- 大口径SiC离轴非球面的高效磨削加工
- Fast grinding of large SiC off-axis aspheric surface
- 光学精密工程 2015年23卷第9期页码：2497-2505
- 作者机构：
  
  1. 中国科学院大学北京,中国,100049
  2. 中国科学院长春光学精密机械与物理研究所中国科学院光学系统先进制造技术重点实验室,吉林长春,130033
- 作者简介：
- 基金信息：
  
  国家863高技术研究发展计划资助项目(No.O8663NJ090)();国家973重点基础研究发展计划资助项目(No.2011CB0132005)();国家自然科学基金
- DOI：10.3788/OPE.20152309.2497
  中图分类号： TN305.2
- 收稿日期：2014-11-14，
  
  修回日期：2014-12-30，
  
  纸质出版日期：2015-09-25
- 稿件说明：
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殷龙海, 王孝坤, 李龙响等. 大口径SiC离轴非球面的高效磨削加工[J]. 光学精密工程, 2015,23(9): 2497-2505

YIN Long-hai, WANG Xiao-kun, LI Long-xiang etc. Fast grinding of large SiC off-axis aspheric surface[J]. Editorial Office of Optics and Precision Engineering, 2015,23(9): 2497-2505
殷龙海, 王孝坤, 李龙响等. 大口径SiC离轴非球面的高效磨削加工[J]. 光学精密工程, 2015,23(9): 2497-2505 DOI： 10.3788/OPE.20152309.2497.

YIN Long-hai, WANG Xiao-kun, LI Long-xiang etc. Fast grinding of large SiC off-axis aspheric surface[J]. Editorial Office of Optics and Precision Engineering, 2015,23(9): 2497-2505 DOI： 10.3788/OPE.20152309.2497.

摘要

研究了空间遥感器用大口径SiC离轴非球面的超声复合磨削加工工艺。分别对磨削原理、金刚石砂轮结合剂选择、机床选取、磨削参数设定等进行了分析

并设计和规划了磨削工艺流程。基于逆向工程原理建立了高精度离轴非球面模型

创立了激光跟踪仪精磨阶段在线测量大口径离轴非球面的工艺。结合工程实践对一口径为700 mm×700 mm的SiC高次离轴非球面元件进行了逆向工程建模和超声磨削加工试验

并利用激光跟踪仪进行了在线检测。经过3个周期(每个周期4 h)的修磨

其面形精度PV值和RMS值分别由45.986 μm和7.949 μm收敛至12.181 μm和2.131 μm;与三坐标测试结果进行对比

其PV值和RMS值的偏差分别为0.892 3 μm和0.312 8 μm。实验显示

提出的磨削工艺实现了大口径SiC离轴非球面的快速精确磨削

其加工精度、效率以及表面质量都有了很大的提高。

Abstract

A fast ultrasonic grinding for SiC off-axis large aspheres used in space remote sensors was researched. The principle of grinding

the selection of diamond grinding wheel bond

the selection of machine tool

and setting grinding parameters were analyzed

and the grinding process was designed. A high precise model of off-axis aspheric surfaces was established on the basis of the principle of reverse engineering

and the online testing method in fine grinding state for a large off-axis aspheric mirror by a laser tracker was established. Combination with an engineering example

the model of a large SiC off-axis asphere with the aperture of 700 mm×700 mm was established by the reverse engineering principle

and it was grinded by ultrasonic method and measured by the laser tracker. After 3 cycles (4 hours per cycle of grinding)

the PV value(45.986 μm) and RMS value(7.949 μm) of the surface error are reduced to 12.181 μm and 2.131 μm

respectively. As compared with three coordinate testing results

the errors of PV value and RMS value are 0.892 3 μm and 0.312 8 μm

respectively. It concludes that the grinding technology realizes fast and high precise grinding for the SiC off-axis large asphere and improves its machining precision

efficiency

and surface quality.

关键词

Keywords

references

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