软性粒子抛光石英玻璃的材料去除机理

刘德福; 陈涛; 陈广林; 胡庆

doi:10.3788/OPE.20162407.1623

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软性粒子抛光石英玻璃的材料去除机理

微纳技术与精密机械 | 更新时间：2020-08-13

- 软性粒子抛光石英玻璃的材料去除机理
- Material removal mechanism for fused glass by using soft particles
- 光学精密工程 2016年24卷第7期页码：1623-1631
- 作者机构：
  
  1.中南大学机电工程学院, 湖南长沙 410083
  2.中南大学高性能复杂制造国家重点试验室, 湖南长沙 410083
- 作者简介：
  
  刘德福(1971-), 男, 湖南茶陵人, 博士, 教授, 博士生导师, 2008年于中南大学获得博士学位, 主要从事精密制造方面的研究. E-mail:liudefu@csu.edu.cnE-mail:liudefu@cus.edu.cn
  [ "陈涛(1986-), 男, 甘肃山丹人, 博士研究生, 2014年于兰州理工大学获得硕士学位, 主要从事精密制造方面的研究。E-mail:ctxy999@126.com" ]
- 基金信息：
  
  国家自然科学基金面上资助项目(51275534);湖南省自然科学基金资助项目(2015JJ2153)
- DOI：10.3788/OPE.20162407.1623
  中图分类号： TQ171.731;TQ171.684
- 收稿日期：2016-01-13，
  
  录用日期：2016-3-12，
  
  纸质出版日期：2016-07
- 稿件说明：
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刘德福, 陈涛, 陈广林, 等. 软性粒子抛光石英玻璃的材料去除机理[J]. 光学精密工程, 2016,24(7):1623-1631.

De-fu LIU, Tao CHEN, Guang-lin CHEN, et al. Material removal mechanism for fused glass by using soft particles[J]. Optics and precision engineering, 2016, 24(7): 1623-1631.
刘德福, 陈涛, 陈广林, 等. 软性粒子抛光石英玻璃的材料去除机理[J]. 光学精密工程, 2016,24(7):1623-1631. DOI： 10.3788/OPE.20162407.1623.

De-fu LIU, Tao CHEN, Guang-lin CHEN, et al. Material removal mechanism for fused glass by using soft particles[J]. Optics and precision engineering, 2016, 24(7): 1623-1631. DOI： 10.3788/OPE.20162407.1623.

摘要

基于阿伦尼乌斯原理和分子振动理论，分析了软性抛光粒子、石英玻璃和抛光垫之间的弹性与超弹性接触，研究了用软性粒子抛光石英玻璃的材料去除机理。基于理论研究进行了大量的抛光试验，建立了软性粒子抛光石英玻璃的材料去除率模型。理论计算与试验结果表明：在石英玻璃化学机械抛光中，材料的去除主要由抛光粒子与石英玻璃的界面摩擦化学腐蚀作用来实现；单个抛光粒子压入石英玻璃的深度约为0.05 nm，且材料去除为分子量级；石英玻璃表层的分子更易获得足够振动能量而发生化学反应实现材料的去除；抛光压力、抛光液中化学试剂种类和浓度以及石英玻璃试件与抛光盘的相对运动速度决定了软性粒子抛光石英玻璃的材料去除率大小。

Abstract

On the basis of Arrhenius theory and molecular vibration theory

the elastic and hyper elastic contact among the soft polishing particles

fused glass and the polishing pad was analyzed

then the material removal mechanism of fused glass using soft particles in polishing process was explored. According to the theoretical research mentioned above

a lots of polishing experiments were carried out and a material removal rate model was established. Theoretical calculation and experimental results show that the material is mainly removed by the interfacial tribo-chemical effect between polishing particles and fused glass in chemical mechanical polishing. The depth of a single particle embedding into the fused glass is 0.05 nm and the material removed by a single particle is a molecular scale. The superficial molecules of fused glass are easier to gain enough energy to implement chemical reactions

so that the materials could be removed easily. Moreover

the polishing pressure

the chemical reagents in polishing liquid

and the relative movement speed between the fused glass and the pad determine the material removal rate of fused glass.

关键词

Keywords

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