用于微反应器塑件整平的等温热压工艺

徐征; 栾庆蕾; 曹栋; 杜立群; 刘冲

doi:10.3788/OPE.20162411.2705

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用于微反应器塑件整平的等温热压工艺

微纳技术与精密机械 | 更新时间：2020-07-07

- 用于微反应器塑件整平的等温热压工艺
- Isothermally hot-embossing methodology for flattening of plastic microreactor
- 光学精密工程 2016年24卷第11期页码：2705-2711
- 作者机构：
  
  1.大连理工大学微纳米技术及系统辽宁省重点实验室, 辽宁大连 116085
  2.大连理工大学精密与特种加工教育部重点实验室, 辽宁大连 116085
- 作者简介：
  
  徐征(1973-),男,河南郑州人,博士,副研究员,1997年、2000年于吉林工业大学分别获得学士、硕士学位,2004年于大连理工大学获得博士学位,主要从事微纳集成制造的研究。E-mail:xuzheng@dlut.edu.cnE-mail:xuzheng@dlut.edu.cn
  [ "栾庆蕾(1991-),男,山东莱芜人,硕士研究生,2013年于山东建筑大学获得学士学位,主要从事聚合物微纳成型工艺方面的研究。E-mail:luanqinglei1990@126.com" ]
- 基金信息：
  
  国家自然科学基金资助项目(No.91023046，No.51475080);辽宁省教育厅重点实验室基金资助项目(LZ2014005);中央高校基本科研业务费专项基金资助项目(No.DUT14LAB07，No.DUT14QY20)
- DOI：10.3788/OPE.20162411.2705
  中图分类号： TQ320.6;TN405
- 收稿日期：2016-02-29，
  
  录用日期：2016-5-19，
  
  纸质出版日期：2016-11-25
- 稿件说明：
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徐征, 栾庆蕾, 曹栋, 等. 用于微反应器塑件整平的等温热压工艺[J]. 光学精密工程, 2016,24(11):2705-2711.

Zheng XU, Qing-lei LUAN, Dong CAO, et al. Isothermally hot-embossing methodology for flattening of plastic microreactor[J]. Editorial office of optics and precision engineeri, 2016, 24(11): 2705-2711.
徐征, 栾庆蕾, 曹栋, 等. 用于微反应器塑件整平的等温热压工艺[J]. 光学精密工程, 2016,24(11):2705-2711. DOI： 10.3788/OPE.20162411.2705.

Zheng XU, Qing-lei LUAN, Dong CAO, et al. Isothermally hot-embossing methodology for flattening of plastic microreactor[J]. Editorial office of optics and precision engineeri, 2016, 24(11): 2705-2711. DOI： 10.3788/OPE.20162411.2705.

摘要

以一种微流控微反应器塑件为对象，提出了用于微塑件整平的等温热压工艺，研究了等温热压工艺对平板微塑件的整平机理。建立了描述该工艺的弹塑性数学模型，计算分析了外加压力和温度对塑件表面形貌的影响。综合考虑塑件整平效果和微结构保形，开展等温热压整平工艺实验，分析了关键工艺参数对器件整平精度的影响。研究结果表明：与压力载荷相比，热载荷对不平度的改善效果更明显；由于塑件端部区域受力面积大，其两端变形量均大于中间反应腔的变形量。在相同压力条件下，70℃时平面度和不平度的变化率均为最高。通过工艺优化，微反应器塑件平面度提高到了10

m内，最大变化率可达72.7%；而不同区域的不平度变化率为3.50%~53.50%，微结构尺寸变化可控制在5

m以下。本文研究成果对提高平板微塑件平整精度有借鉴作用。

Abstract

An isothermally hot-embossing methodology was proposed for the flattening of plastic microreactors. The flattening principles of a plane plastic microreactor by the isothermally hot-embossing methodology were researched and an elastic-plastic model was established to describe the deformation process. The influences of temperature and pressure on the topography of plastic microparts were quantitatively analyzed. By considering the flattening effect and microstructure of the plastic microreactor

the effect of main technological parameters on the flattening accuracy was analyzed by the isothermally hot-embossing methodology. The result indicates that the influence of thermal load on flattening degree is more obvious than that of the external pressure. The deformations at the ends of microreactor are much larger than that of the middle chamber owing to the larger contact area at the ends. The changing rates of flatness and waviness come to the maximum value when the temperature is 70℃ at the same pressure. After optimization

the changing rate of flatness achieves to 72.7% and the flatness of the microreactor is improved within 10

m by the hot embossing technology. Moreover

the changing rate of waviness ranges from 3.50% to 53.5% at different regions of plastic microparts and the deformation of the microstructure size is controlled within 5

m. The study is beneficial to improrement of the precision of flat plastic microparts.

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references

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