光子晶体光纤端面研磨损伤的分析

冯迪; 赵正琪; 房启蒙; 宋凝芳

doi:10.3788/OPE.20172511.2895

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光子晶体光纤端面研磨损伤的分析

微纳技术与精密机械 | 更新时间：2020-07-07

- 光子晶体光纤端面研磨损伤的分析
- Analysis of end face damage in lapping for photonic crystal fiber
- 光学精密工程 2017年25卷第11期页码：2895-2903
- 作者机构：
  
  北京航空航天大学仪器科学与光电工程学院, 北京 100191
- 作者简介：
  
  [ "冯迪(1972-), 男, 陕西西安人, 博士, 副教授, 硕士生导师, 1994年于浙江大学获得学士学位, 2000年于北京机械工业学院获得硕士学位, 2003年于清华大学获得博士学位, 主要从事衍射微纳光学器件方面的研究。E-mail:fengdi@buaa.edu.cn" ]
  [ "赵正琪(1992-), 男, 四川南充人, 硕士研究生, 2014年于北京航空航天大学获得学士学位, 主要从事光子晶体光纤端面研磨方面的研究。E-mail:sy1417109@buaa.edu.cn" ]
- 基金信息：
  
  国家重大科学仪器专项基金资助项目(2013YQ040877)
- DOI：10.3788/OPE.20172511.2895
  中图分类号： TN253
- 收稿日期：2016-11-17，
  
  录用日期：2017-1-10，
  
  纸质出版日期：2017-11-25
- 稿件说明：
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冯迪, 赵正琪, 房启蒙, 等. 光子晶体光纤端面研磨损伤的分析[J]. 光学精密工程, 2017,25(11):2895-2903.

Di FENG, Zheng-qi ZHAO, Qi-meng FANG, et al. Analysis of end face damage in lapping for photonic crystal fiber[J]. Optics and precision engineering, 2017, 25(11): 2895-2903.
冯迪, 赵正琪, 房启蒙, 等. 光子晶体光纤端面研磨损伤的分析[J]. 光学精密工程, 2017,25(11):2895-2903. DOI： 10.3788/OPE.20172511.2895.

Di FENG, Zheng-qi ZHAO, Qi-meng FANG, et al. Analysis of end face damage in lapping for photonic crystal fiber[J]. Optics and precision engineering, 2017, 25(11): 2895-2903. DOI： 10.3788/OPE.20172511.2895.

摘要

对光子晶体光纤的端面研磨过程进行研究，讨论了光子晶体光纤端面研磨损伤的特点。针对光子晶体光纤的结构特点，应用有限元法建立了数值仿真模型。通过单一磨粒切削孔壁的仿真实验，分析了不同切削深度下裂纹损伤的产生情况以及不同磨粒直径对光纤孔壁结构造成的损伤。最后通过实际研磨实验验证了分析结果。结果表明：有限元法能够很好地模拟光子晶体光纤的端面研磨过程；研磨过程中，相对于非孔洞区域，孔壁边缘更容易出现损伤，呈现出沿圆周分布的崩塌区域；边缘崩塌区域尺寸随磨粒直径的增加而增加。实验用光子晶体光纤孔壁边缘无崩塌的最大切削深度低于普通光纤脆塑转变的临界切削深度，使用0.02 μm的砂纸进行抛光可以有效地避免对光子晶体光纤孔壁造成损伤。

Abstract

The lapping process for photonic crystal fibers (PCFs) was studied

and the end face damage of the PCFs was discussed. Based on the structure characteristics of the PCFs

a digital simulation model was established by finite element method. Through the simulation of a single grinding hole wall

the occurrence of crack damage under different cutting depths and the effect of damage caused by different grinding grain diameters on the structure of fiber hole wall were analyzed. Finally

the analysis results were verified by the PCF end face lapping experiments. The results show that FEM can effectively simulate the end face lapping process of PCF. As compared to the non hole region

the edge of hole wall is more prone to damage in the lapping process

showing a collapse area distributed along the circumference. The size of collapse area increases with the grit diameter. For no collapse area generation

the maximum cutting depth of this PCF is less than the critical cutting depth of brittle plastic transition of ordinary fiber and the abrasive paper with a thickness of 0.02 μm can be used to polish to avoid the damage on the PCF hole wall.

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references

陈鹤鸣, 吴唯冉, 汪静丽.填充液体与方式对光子晶体光纤温敏特性的影响[J].光学精密工程, 2015, 23(10Z):120-126.

CHEN H M, WU W R, WANG J L. Effect of different liquid and filling modes on thermo sensitive characteristics of photonic crystal fibers[J]. Opt. Precision Eng., 2015, 23(10Z):120-126. (in Chinese)

高静, 于峰, 匡鸿深, 等.纳秒声光调Q光纤激光器产生超连续谱[J].光学精密工程, 2014, 22(5):1138-1142.

GAO J, YU F, KUANG H SH, et al.. Generation of supercontinuum spectra from acousto-optic Q-switched nanosecond fiber lasers[J]. Opt. Precision Eng., 2014, 22(5):1138-1142. (in Chinese)

SU H X, LI Y G, LU K CH, et al.. Wavelength tunable Yb 3+ -doped double-clad photonic crystal fiber laser[J]. SPIE, 2008, 6823:18-19.

刘德福, 段吉安, 钟掘.光纤端面研磨加工的表面质量[J].机械工程学报, 2006, 42(2):187-191.

LIU D F, DUAN J A, ZHONG J. Surface quality in end-face lapping of optical fiber[J]. Journal of Mechanical Engineering, 2006, 42(2):187-191. (in Chinese)

BIFANO T G, DOW T A, SCATTERGOOD R O. Ductile-regime grinding:a new technology for machining brittle materials[J]. Journal of Engineering for Industry, 1991, 113(2):184-189.

DONG Z C, CHENG H B. Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets[J]. International Journal of Machine Tools and Manufacture, 2014, 85:1-13.

BLAINEAU P, ANDRÉ D, LAHEURTE R, et al.. Subsurface mechanical damage during bound abrasive grinding of fused silica glass[J]. Applied Surface Science, 2015, 353:764-773.

刘伟, 邓朝晖, 万林林, 等.单颗金刚石磨粒切削氮化硅陶瓷仿真与试验研究[J].机械工程学报, 2015, 51(21):191-198.

LIU W, DENG CH H, WAN L L. Simulation and experiment study for silicon nitride cutting with single diamond grain[J]. Journal of Mechanical Engineering, 2015, 51(21):191-198. (in Chinese)

LAURO C H, BRANDÃO L C, FILHO S L M R, et al.. Finite Element Method in Machining Processes:A Review[M]. Berlin:Springer International Publishing, 2015.

刘德福, 段吉安.光纤端面研磨加工机理研究[J].光学精密工程, 2004, 12(6):570-575.

LIU D F, DUAN J A. Mechanism research on lapping of optical fiber end-face[J]. Opt. Precision Eng., 2004, 12(6):570-575. (in Chinese)

NAM J, KIM T, CHO S W. A numerical cutting model for brittle materials using smooth particle hydrodynamics[J]. International Journal of Advanced Manufacturing Technology, 2016, 82(1-4):133-141.

LV Z, HUANG CH ZH, ZHU H T, et al.. FEM analysis on the abrasive erosion process in ultrasonic-assisted abrasive waterjet machining[J]. International Journal of Advanced Manufacturing Technology, 2015, 78(9-12):1641-1649.

CRONIN D S, BUI K, KAUFMANN C, et al.. Implementation and validation of the Johnson-Holmquist ceramic material model in LS-Dyna[C]. Proceedings of the 4 th European LS-DYNA Users Conference , Livermore Software Technology Corporation ( LSTC ) and Engineering Technology Associates , Inc . ( ETA ), 2003, 1:47-60. http://www.thefullwiki.org/Johnson-Holmquist_damage_model

张壁, 孟鉴.工程陶瓷磨削加工损伤的探讨[J].纳米技术与精密工程, 2003, 1(1):48-56.

ZHANG B, MENG J. Grinding damage in fine ceramics[J]. Nanotechnology and Precision Engineering, 2003, 1(1):48-56. (in Chinese)

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