基于多图像融合的MEMS显微三维形貌重构

丁汛; 赵跃进; 丁玉奎

doi:10.3788/OPE.20182605.1275

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基于多图像融合的MEMS显微三维形貌重构

信息科学 | 更新时间：2020-08-13

- 基于多图像融合的MEMS显微三维形貌重构
- Three-dimensional microscopic reconstruction of MEMS based on multi image fusion
- 光学精密工程 2018年26卷第5期页码：1275-1285
- 作者机构：
  
  1.北京理工大学光电学院精密光电测试仪器及技术北京市重点实验室, 北京 100081
  2.北京圣非凡电子系统技术开发有限公司, 北京 102200
  3.陆军工程大学石家庄校区, 河北石家庄 050003
- 作者简介：
  
  [ "丁汛(1991-), 男, 河北石家庄人, 硕士, 2015年于合肥工业大学获得学士学位, 2017年于北京理工大学获得硕士学位, 主要从事光学精密测量技术方面的研究。E-mail:bxjxxdx@163.com" ]
  [ "赵跃进(1958-), 男, 河北涉县人, 教授, 博士生导师, 1982年、1986年、1990年于北京理工大学光电工程系光学仪器专业分别获得学士、硕士、博士学位, 现任\"仪器科学与技术\"一级学科和\"精密仪器及机械\"二级学科负责人, 主要从事电子稳像、THz成像技术、基于MEMS的红外成像技术等方面的研究。E-mail:yjzhao@bit.edu.cn" ]
- 基金信息：
  
  国家自然科学基金资助项目(61301190);国家自然科学基金资助项目(61377109);国家自然科学基金资助项目(61475018)
- DOI：10.3788/OPE.20182605.1275
  中图分类号： TP391.41;TH742
- 收稿日期：2017-09-11，
  
  录用日期：2017-11-10，
  
  纸质出版日期：2018-05-25
- 稿件说明：
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丁汛, 赵跃进, 丁玉奎. 基于多图像融合的MEMS显微三维形貌重构[J]. 光学精密工程, 2018,26(5):1275-1285.

Xun DING, Yue-jin ZHAO, Yu-kui DING. Three-dimensional microscopic reconstruction of MEMS based on multi image fusion[J]. Optics and precision engineering, 2018, 26(5): 1275-1285.
丁汛, 赵跃进, 丁玉奎. 基于多图像融合的MEMS显微三维形貌重构[J]. 光学精密工程, 2018,26(5):1275-1285. DOI： 10.3788/OPE.20182605.1275.

Xun DING, Yue-jin ZHAO, Yu-kui DING. Three-dimensional microscopic reconstruction of MEMS based on multi image fusion[J]. Optics and precision engineering, 2018, 26(5): 1275-1285. DOI： 10.3788/OPE.20182605.1275.

摘要

针对微型机电系统（MEMS）的三维测量，显微镜或光学轮廓干涉仪等传统方法存在显微测量精度低、设备成本高等问题，且当结构含有较多断裂面时，解包裹算法效果欠佳。本文提出一种基于多图像融合的MEMS显微三维测量方法。不同于多角度显微三维测量方法，本研究首先利用单目显微镜，通过单一轴向移动获取一系列测量目标深度信息的单一角度图像，并利用去雾算法对图像进行预处理，实现了去噪和有效信息提取的目的；然后通过聚焦测度算法获取待测对象的深度信息；最后利用数据处理软件进行三维拟合。基于上述原理，本文以焦平面阵列（FPA）作为待测目标进行了测量实验。本文提出的三维测量方法和图像处理算法可获得更准确的FPA形貌，可清晰显示反射面与支腿部分及反射面上的释放孔，测得FPA的支腿长度为110.6

m，每个反射面的像元尺寸为120.8

m×70.8

m，与设计值基本吻合，解决了断裂面难以测量的问题，同时降低了微结构测量的难度和成本。单目显微镜单向移动的多图像融合测量技术对MEMS的三维形貌测量具有重要意义，去雾算法在图像融合与三维测量的图像处理也有很好的应用价值。

Abstract

In order to realize the three-dimensional measurement of micro electro-mechanical systems (MEMS)

it is usually necessary to use a microscope or an optical profilometer. However

the traditional method has problems such as low precision and high cost of detection equipment

and it cannot achieve good results for an MEMS structure with many fracture surfaces. A new method for 3D measurement and image processing was presented in this paper. Unlike the three-dimensional reconstruction measurement method of multi-angle microscopes

this study firstly used a monocular microscope to obtain a series of single point measurements of the target

thus acquiring the depth information through single axial images. Then

a defogging algorithm was adopted for image preprocessing

denoising

and achieving effective information extraction. Subsequently

the depth information of the object to be tested was obtained using a focus measure algorithm. Finally

3D fitting was performed using the data processing software. Based on the above principle

the focal plane array (FPA) was taken as the target to be measured. The experimental results show that the proposed 3D reconstruction method and image processing algorithm can obtain a more accurate FPA morphology

and can clearly show the release hole reflecting surface and the leg part on the reflector. The leg length of the FPA is measured to be 110.6

and the pixel size of each reflector is about 120.8

m×70.8

which is consistent with the design value. It solves the problem of measuring the fracture surface

and reduces the difficulty and cost of microstructure measurement. The multi-directional image-fusion measurement technology using a monocular microscope is of great significance for MEMS 3D profile measurement. The defogging algorithm has significant application value in image fusion and 3D measurement image processing.

关键词

Keywords

references

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