补强型透明电子灌封胶的制备及性能

范敬辉; 吴菊英; 马艳

doi:10.3788/OPE.20182609.2169

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补强型透明电子灌封胶的制备及性能

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- 补强型透明电子灌封胶的制备及性能
- Preparation and properties of reinforced transparent electronic encapsulant
- 光学精密工程 2018年26卷第9期页码：2169-2173
- 作者机构：
  
  中国工程物理研究院总体工程研究所, 四川绵阳 621999
- 作者简介：
  
  [ "范敬辉(1971-), 女, 黑龙江黑河人, 高级工程师, 1994年于哈尔滨电工学院获得学士学位, 主要从事光电子元器件封装材料制备及应用的研究。E-mail:fanjh@caep.cn" ]
  [ "吴菊英(1969-), 女, 四川泸州人, 高级工程师, 1993年、2000年于四川大学分别获得学士、硕士学位, 主要从事聚合物合成及表征的研究。E-mail:wujy@caep.cn" ]
- 基金信息：
  
  国家自然科学基金委员会-中国工程物理研究院联合基金资助项目(U1530102);四川省科技厅应用基础研究重点项目(2017JY0149)
- DOI：10.3788/OPE.20182609.2169
  中图分类号： TP324;TQ322.4
- 收稿日期：2018-05-24，
  
  录用日期：2018-6-29，
  
  纸质出版日期：2018-09-25
- 稿件说明：
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范敬辉, 吴菊英, 马艳. 补强型透明电子灌封胶的制备及性能[J]. 光学精密工程, 2018,26(9):2169-2173.

Jing-hui FAN, Ju-ying WU, Yan MA. Preparation and properties of reinforced transparent electronic encapsulant[J]. Optics and precision engineering, 2018, 26(9): 2169-2173.
范敬辉, 吴菊英, 马艳. 补强型透明电子灌封胶的制备及性能[J]. 光学精密工程, 2018,26(9):2169-2173. DOI： 10.3788/OPE.20182609.2169.

Jing-hui FAN, Ju-ying WU, Yan MA. Preparation and properties of reinforced transparent electronic encapsulant[J]. Optics and precision engineering, 2018, 26(9): 2169-2173. DOI： 10.3788/OPE.20182609.2169.

摘要

为了改善透明电子灌封胶的力学性能，采用加成反应制备了补强型室温固化透明电子灌封胶。首先，通过开环聚合制备乙烯基封端的聚硅氧烷；以硅氢基封端的聚硅氧烷为交联剂，在铂配合物的催化作用下，制备得到可室温固化的透明型灌封基胶。采用MQ硅树脂对基胶进行补强，研究了MQ硅树脂的含量对灌封胶透光性、力学和绝缘性能的影响。结果表明，MQ硅树脂在含量15份时，补强型灌封胶的可见光透过率、电阻率、拉伸强度分别达到84%、2.77×10

Ω·cm、5.2 MPa；MQ硅树脂的适量加入有效提高了灌封胶的力学性能；试样在热老化和湿热老化之后仍保持优良的光学、力学和绝缘性能。

Abstract

To improve the mechanical property of transparent electronic encapsulant

reinforced transparent electronic encapsulant was obtained by additional method at room temperature. Firstly

vinyl-terminated polysiloxane was synthesized by ring-opening polymerization. Using Si-H-terminated polysiloxane as crosslinking agent and platinum complexes as catalyst

the transparent gum that cured at room temperature was prepared and subsequently reinforced by filling in MQ silicone resin. The influence of the amount of MQ silicone resin on the transmittance

mechanics

and insulation performance of the encapsulant was studied. The results indicate that the tensile strength

transmittance

and resistivity of the encapsulant reach 5.2 MPa

84%

and 2.77×10

Ω·cm

respectively

when the MQ silicone resin content is 15 phr; the mechanics performance is markedly improved when a suitable quantity of MQ silicone resin is filled in; the mechanics

transmittance

and insulation performance of the encapsulant is excellent after thermal aging

damp and thermal aging.

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Keywords

references

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