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1.华侨大学 制造工程研究院,福建 厦门 361021
2.华侨大学 硬脆性材料加工技术教育部工程研究中心,福建 厦门 361021
[ "王文珊(1972-),女,福建人,博士研究生,主要研究方向为高效精密加工。E-mail:wenshan@hqu.edu.cn" ]
胡中伟(1979-),男,湖北咸宁人,博士,讲师,硕士生导师,2011年于湖南大学获得博士学位,主要研究方向为高效精密加工。E-mail:huzhongwei@hqu.edu.cn HU Zhong-wei, E-mail:huzhongwei@hqu.edu.cn
收稿日期:2018-06-21,
录用日期:2018-8-21,
纸质出版日期:2019-01-25
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王文珊, 胡中伟, 赵欢, 等. 蜂窝状结构半固结磨料研磨盘的制备及应用[J]. 光学 精密工程, 2019,27(1):69-77.
Wen-shan WANG, Zhong-wei HU, Huan ZHAO, et al. Preparation and application of semi-fixed abrasive lapping plates with cecullar structure[J]. Optics and precision engineering, 2019, 27(1): 69-77.
王文珊, 胡中伟, 赵欢, 等. 蜂窝状结构半固结磨料研磨盘的制备及应用[J]. 光学 精密工程, 2019,27(1):69-77. DOI: 10.3788/OPE.20192701.0069.
Wen-shan WANG, Zhong-wei HU, Huan ZHAO, et al. Preparation and application of semi-fixed abrasive lapping plates with cecullar structure[J]. Optics and precision engineering, 2019, 27(1): 69-77. DOI: 10.3788/OPE.20192701.0069.
针对传统半固结研磨盘由于盘面较软使得加工衬底面形精度难以保证的问题,提出一种蜂窝状结构的半固结磨料研磨盘的设计与制备方法。该研磨盘采用环氧树脂蜂窝结构作为支撑“骨架”,减小研磨盘的变形,以保证研磨衬底的面形精度,同时采用含有金刚石磨粒的凝胶体作为半固结研磨介质实现对衬底的研磨加工,获得了较好的衬底表面质量。基于该原理制备了一套新型研磨盘,并用于蓝宝石衬底的双面研磨加工。试验结果表明,研磨后衬底表面粗糙度较小,表面划痕和裂纹少,能够获得较好的表面质量;相应地,研磨后蓝宝石衬底的面形精度不仅没有变差,反而得到很大的改善,研磨后衬底的翘曲度、弯曲度和总厚度偏差均大幅减小。另外,研磨效率也相对较高,材料去除率可达0.3~0.4 μm/min。试验结果证明了该新型结构研磨盘不仅可以获得较好的表面质量和较高的研磨效率,同时还可提高衬底的面形精度,可用于面形精度要求较高的薄片衬底零件的精密研磨加工。
In addition to a good surface quality
surface shape accuracy is also necessary. However
it is difficult to guarantee the surface shape accuracy of the substrate during lapping with the general semi-fixed lapping owing to the lapping plate's soft surface. Therefore
we propose a new design and preparation method of semi-fixed lapping plate with cellular structure. The cellular structure made of epoxy resin is designed to play a supporting role
which can reduce the deformation of the lapping plate and improve the surface shape accuracy. The cellular structure is filled with a soft gel with diamond abrasives
which play a role in semi-fixed lapping. Based on this principle
a new structure semi-fixed abrasive lapping plate is prepared and used to lap sapphire substrates. Experimental results show that good surface quality can be obtained with a low surface roughness and a flatter surface with fewer scratches and cracks. Accordingly
the surface shape accuracy of the sapphire substrate has been improved in lapping process. After lapping
the Bow
Warp
and TTV of the substrate are greatly reduced. The lapping efficiency is relatively high
and the material removal rate is 0.3~0.4 μm/min. The experimental results indicate not only good surface quality
but an improved surface shape accuracy of the substrate can be obtained by lapping with the new structure semi-fixed abrasive lapping plate. Therefore
this new lapping plate can be used to process the conductor substrates that have a high requirement for both surface quality and surface shape accuracy.
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