选区激光熔化成形W-Ni-Cu的成形工艺及热物理性能

闫岸如; 刘学胜; 王智勇; 贺定勇

doi:10.3788/OPE.20192705.1024

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选区激光熔化成形W-Ni-Cu的成形工艺及热物理性能

现代应用光学 | 更新时间：2020-08-13

- 选区激光熔化成形W-Ni-Cu的成形工艺及热物理性能
- Process parameters and thermal physical properties of W-Ni-Cu composite fabricated using selective laser melting
- 光学精密工程 2019年27卷第5期页码：1024-1032
- 作者机构：
  
  北京工业大学材料科学与工程学院，北京 100124
- 作者简介：
  
  [ "闫岸如 (1988-)，女，山西太原人，博士，助理研究员，2017年于北京工业大学获得博士学位，现为北京工业大学材料科学与工程学院博士后，主要从事激光3D打印金属粉末方面的研究。E-mail：yar_0816@126.com" ]
- 基金信息：
  
  国家重点研发计划资助项目(2017YFB0305800)
- DOI：10.3788/OPE.20192705.1024
  中图分类号： TG146.411;TG665
- 收稿日期：2018-12-20，
  
  录用日期：2019-2-1，
  
  纸质出版日期：2019-05-15
- 稿件说明：
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闫岸如, 刘学胜, 王智勇, 等. 选区激光熔化成形W-Ni-Cu的成形工艺及热物理性能[J]. 光学精密工程, 2019,27(5):1024-1032.

An-ru YAN, Xue-sheng LIU, Zhi-yong WANG, et al. Process parameters and thermal physical properties of W-Ni-Cu composite fabricated using selective laser melting[J]. Optics and precision engineering, 2019, 27(5): 1024-1032.
闫岸如, 刘学胜, 王智勇, 等. 选区激光熔化成形W-Ni-Cu的成形工艺及热物理性能[J]. 光学精密工程, 2019,27(5):1024-1032. DOI： 10.3788/OPE.20192705.1024.

An-ru YAN, Xue-sheng LIU, Zhi-yong WANG, et al. Process parameters and thermal physical properties of W-Ni-Cu composite fabricated using selective laser melting[J]. Optics and precision engineering, 2019, 27(5): 1024-1032. DOI： 10.3788/OPE.20192705.1024.

摘要

为了研究W-Ni-Cu合金选区激光熔化技术(SLM)直接成形工艺及其热物理性能，设计了以激光功率、扫描速度、扫描线长度、搭接率为变量的工艺实验，研究各参数对致密度的影响，采用SEM、热分析仪、差式扫描量热仪、热-机械分析仪研究合金的微观组织、导热率与热膨胀系数。结果表明：选择合理的优化工艺参数，W-Ni-Cu(SLM)成形致密度最高达到94.5%；微观组织为难熔相W发生了桥接与团聚，基体相CuNi呈网络状包裹于W相周围；测试试样所加载热流平行于烧结成形方向时，导热系数与热膨胀系数分别是120.314 0 W/(m·K)及7.16×10

-6

/K，加载热流方向垂直于烧结成形方向时，导热系数与热膨胀系数分别是99.257 2 W/(m·K)及7.02×10

-6

/K。不同方向成形测试件导热系数和热膨胀系数的差异是由难熔相W在CuNi相中的分布以及孔隙数量决定的。采用选区激光熔化成形技术可以成形性能较好的W-Ni-Cu合金。

Abstract

To investigate the process and thermal physical performance of W-Ni-Cu manufactured using the Selective Laser Melting (SLM) technique

an experiment of four variables was conducted to study the influence of laser power

scanning speed

length of the scanning line

and overlap rate on the density. Scanning electron microscopy as well as a thermal analyzer

differential scanning calorimeter

and thermal-mechanical analyzer were used to study the microstructure

thermal conductivity

and thermal expansion. The results show that the density of W-Ni-Cu reaches 94.5% with the optimized process. The microstructure is a type of bridging connection

and agglomeration occurs between the W phases and CuNi phase that wraps around the W phase like a network. When the measuring direction is parallel to the processing direction

the thermal conductivity and thermal expansion coefficients are 120.314 0 W/m·K and 7.16×10

-6

respectively. When the measuring direction is perpendicular to the processing direction

the thermal conductivity and thermal expansion coefficients are 99.257 2 W/m·K and 7.02×10

-6

respectively. Test pieces form in different directions with different thermal conductivity and thermal expansion coefficients because of the distribution of W in CuNi and the existence of pores. The study shows that the W-Ni-Cu alloy parts exhibiting better performance can be manufactured directly using SLM.

关键词

Keywords

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