基于硅各向同性腐蚀工艺的三维曲面壳体微谐振器制备技术

庄须叶; 陈丙根; 李平华; 王新龙; 曹卫达; 丁景兵

doi:10.3788/OPE.20192706.1293

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基于硅各向同性腐蚀工艺的三维曲面壳体微谐振器制备技术

生命科学仪器 | 更新时间：2020-08-13

- 基于硅各向同性腐蚀工艺的三维曲面壳体微谐振器制备技术
- Fabrication of microscale axial symmetric three-dimensional curved shell resonators based on silicon isotropic wet etching
- 光学精密工程 2019年27卷第6期页码：1293-1300
- 作者机构：
  
  华东光电集成器件研究所，安徽蚌埠 233042
- 作者简介：
  
  [ "庄须叶(1981-)，男，山东日照人，研究员，2004年于西南石油大学获得学士学位，2009年于中科院长春光学精密机械与物理研究所获得博士学位，主要从事MEMS技术的研究。E-mail：zxye8888@163.com" ]
  陈丙根(1974-)，男，安徽望江人，高级工程师，1997年于安徽大学获得学士学位，主要从MEMS、EMCCD和LTCC等技术的研究。E-mail：cbg214@163.com CHEN Bing-gen, E-mail: cbg214@163.com
- 基金信息：
  
  国家自然基金资助项目(51875585)
- DOI：10.3788/OPE.20192706.1293
  中图分类号： TP212.9
- 收稿日期：2018-12-18，
  
  录用日期：2019-2-16，
  
  纸质出版日期：2019-06-15
- 稿件说明：
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庄须叶, 陈丙根, 李平华, 等. 基于硅各向同性腐蚀工艺的三维曲面壳体微谐振器制备技术[J]. 光学精密工程, 2019,27(6):1293-1300.

Xu-ye ZHUANG, Bing-gen CHEN, Ping-hua LI, et al. Fabrication of microscale axial symmetric three-dimensional curved shell resonators based on silicon isotropic wet etching[J]. Optics and precision engineering, 2019, 27(6): 1293-1300.
庄须叶, 陈丙根, 李平华, 等. 基于硅各向同性腐蚀工艺的三维曲面壳体微谐振器制备技术[J]. 光学精密工程, 2019,27(6):1293-1300. DOI： 10.3788/OPE.20192706.1293.

Xu-ye ZHUANG, Bing-gen CHEN, Ping-hua LI, et al. Fabrication of microscale axial symmetric three-dimensional curved shell resonators based on silicon isotropic wet etching[J]. Optics and precision engineering, 2019, 27(6): 1293-1300. DOI： 10.3788/OPE.20192706.1293.

摘要

轴对称3D曲面壳体谐振器具有自身对称性好、耐冲击能力强、可靠性高的特点，是应用最为广泛的谐振器之一，但因制备工艺涉及薄壳结构的曲面成形过程，属于MEMS 3D工艺，很难进行批量化制备。基于硅各向同性湿法技术对多晶硅3D曲面壳体谐振器的批量化制备工艺进行了实验研究。设计了脱模法制备多晶硅3D曲面壳体结构的工艺流程，实验优选体积比为15:10:75的醋酸、氢氟酸、硝酸的混合液各向同性腐蚀制备硅半球腔模具，利用自制的水浴设备和水平度可调夹具，对刻蚀液温度和扩散速度进行了有效控制，减弱了反应放热和硅基片放置不水平对硅半球腔圆度与粗糙度的影响。制备了直径为0.8~1.3 mm的多晶硅3D曲面壳体结构，测试对称性最好优于0.4%，多晶硅3D曲面壳体结构的表面粗糙度优于1 nm。在0.2 Pa的压强下，激光多普勒测试得到曲面壳体谐振器的谐振频率为28 kHz，

值为14 365，调节驱动电压和偏置电压可实现谐振器四波腹谐振模态的模式匹配，基频差趋于零。

Abstract

Axial symmetric curved shell resonators are among the most-widely used resonators because of their high symmetry

robustness

and reliability. However

the fabrication of this kind of resonator is based on newly developed three-dimensional (3D) microelectromechanical system technologies

making it difficult to fabricate. Polysilicon shell resonator is suitable for batch fabrication owing to its compatibility with the materials and fabrication technologies used in the IC industry

which is of high value and should be studied thoroughly. A 3D polysilicon shell resonator with high symmetry was produced using silicon cave as its mold

and the fabrication process was designed and tested experimentally. The cave was formed by isotropic etching of silicon

using a mixture of HF/HNO

/CH

CHOOH with bulk ratio 15:10:75 as the etchant. The temperature of the etchant was controlled using a water bath to ensure that the speed of the etching does not change abruptly. The level of the wafer was maintained by a clamp with which the wafers position could be adjusted freely. The abovementioned measures ensured that the silicon caves had good properties

especially the symmetry and roughness. Then

3D polysilicon shells with diameters ranging from 0.8 to 1.3 mm were fabricated

with the smallest roundness less than 0.4%. The roughness of the shell was less than 1 nm. The resonant properties of the fabricated shells were investigated using noncontact characterization methods facilitated by a laser Doppler vibrometer. A mechanical quality (

) of 14 365 at 28 kHz was obtained in vacuum with a pressure of 0.2 Pa. By adjusting the bias voltage and actuated voltage

the mode-matching situation was achieved

and the relative frequency mismatch between the two degenerate four-node wineglass modes was reduced to zero.

关键词

Keywords

references

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