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1.长春理工大学 半导体激光全国重点实验室,吉林 长春 130022
2.西南技术物理研究所,四川 成都 610041
Received:03 April 2026,
Revised:2026-04-27,
Online First:14 August 2026,
Published:10 August 2026
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孙龙龙,唐吉龙,张聪等.852 nm波段半导体激光器研究进展[J].光学精密工程,2026,34(15):2331-2358.
SUN Longlong,TANG Jilong,ZHANG Cong,et al.Research advances in semiconductor lasers at 852 nm band[J].Optics and Precision Engineering,2026,34(15):2331-2358.
孙龙龙,唐吉龙,张聪等.852 nm波段半导体激光器研究进展[J].光学精密工程,2026,34(15):2331-2358. DOI: 10.37188/OPE.20263415.2331. CSTR: 32169.14.OPE.20263415.2331.
SUN Longlong,TANG Jilong,ZHANG Cong,et al.Research advances in semiconductor lasers at 852 nm band[J].Optics and Precision Engineering,2026,34(15):2331-2358. DOI: 10.37188/OPE.20263415.2331. CSTR: 32169.14.OPE.20263415.2331.
852 nm半导体激光器与铯原子D₂线跃迁高度匹配,是铯原子钟、量子传感、冷原子操控和精密光谱系统中的关键光源。系统综述了852 nm波段半导体激光器在量子阱材料体系、器件结构设计、核心性能优化及工程应用方面的研究进展。从材料演进角度分析了AlGaAs/GaAs、无铝InGaAsP/GaAs和InAlGaAs/GaAs等体系的发展逻辑,阐明了载流子限制能力、腔面可靠性、温度稳定性和电光转换效率之间的内在关联。按照器件类型总结了分布反馈激光器(Distributed Feedback Laser, DFB)、垂直腔面发射激光器(Vertical-Cavity Surface-Emitting Laser, VCSEL)、外腔反馈激光器、垂直外腔面发射激光器(Vertical External-Cavity Surface-Emitting Laser,VECSEL)及高功率边发射激光器的发展现状,比较了其在线宽、功率、斜率效率、单模稳定性和系统集成方面的性能差异。最后,对国内外商用852 nm半导体激光器产品进行了分析,指出当前国内仍主要集中在代理销售、模块封装和整机集成环节,核心芯片及增益芯片仍依赖国外供应。未来,852 nm半导体激光器会向窄线宽、高功率、高效率、宽温稳定、高可靠和芯片级集成方向发展,为新一代铯原子钟和量子精密测量系统提供支撑。
Semiconductor lasers emitting at 852 nm are essential light sources for cesium-based atomic systems because their wavelength is resonant with the Cs D
2
transition. They support cesium atomic clocks, quantum sensing, cold-atom manipulation, and precision spectroscopy. This review addresses the need for a systematic assessment of 852 nm laser technologies by summarizing recent advances in quantum-well material systems, device architectures, performance optimization, and engineering applications. The development of AlGaAs/GaAs, aluminum-free InGaAsP/GaAs, and InAlGaAs/GaAs active-region platforms is first reviewed. The effects of material design on carrier confinement, facet reliability, thermal stability, and electro-optical conversion efficiency are analyzed. Major device configurations—including vertical-cavity surface-emitting lasers, distributed-feedback lasers, external-cavity diode lasers, vertical external-cavity surface-emitting lasers, and high-power edge-emitting lasers-are then evaluated according to their structural characteristics and performance metrics. Their relative capabilities in linewidth, output power, slope efficiency, single-mode stability, and system-level integration are compared. Commercial 852 nm semiconductor l
aser products are further assessed from an application-oriented perspective. Current domestic activities are concentrated primarily on product distribution, module packaging, and system integration, whereas core laser chips and gain chips remain largely dependent on overseas suppliers. Future development should prioritize narrower linewidths, higher output power, improved electro-optical efficiency, wider operating-temperature ranges, enhanced reliability, and chip-scale integration. These advances are expected to support next-generation cesium atomic clocks and quantum precision-measurement systems.
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