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Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection
Micro/Nano Technology and Fine Mechanics | 更新时间：2024-09-04
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    • Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection

    • “在晶圆翘曲检测领域，专家提出了改进的竖直自动装夹方案，通过精确约束和简化装夹流程，有效控制了晶圆附加翘曲，为高精度测量提供了新方法。”
    • Optics and Precision Engineering   Vol. 32, Issue 15, Pages: 2418-2428(2024)

    • DOI：10.37188/OPE.20243215.2418    

      CLC： TN707;TN405

    • Published：10 August 2024，

      Received：07 December 2023，

      Revised：18 January 2024，

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  • ZHANG Yibo,KONG Xinxin,ZHAO Sizepeng,et al.Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection[J].Optics and Precision Engineering,2024,32(15):2418-2428. DOI： 10.37188/OPE.20243215.2418.

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Related Author

ZHANG Yibo
KONG Xinxin
JIANG Dehuai
ZHAO Sizepeng
JIA Jingang
SONG Jiahui
WU Zhou
QIN Chao

Related Institution

Key Laboratory of On-orbit Manufacturing and Integration for Space Optics System， Chinese Academy of Sciences
University of Chinese Academy of Sciences
Changchun Institute of Optics， Fine Mechanics and Physics， Chinese Academy of Sciences
Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material， Intelligent Manufacturing Institute， Hunan University of Science and Technology
School of Manufacturing Science and Engineering，Southwest University of Science and Technology
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